{"text_format":"3","workbook":"xlsx","n_sheets":3,"sheets":["MCD","SCD","Abbreviations"],"not_rendered":{"images":16,"defined_names":4},"read":"whole","date_system":"1900"}

{"sheet":"MCD","index":0,"n_rows":23,"n_cols":25,"rows_kept":23,"merged":[[1,0,1,24],[2,0,2,24],[4,8,4,9],[5,16,5,17],[6,3,6,24],[7,19,7,24],[8,0,8,24],[12,5,12,14],[12,18,12,23],[12,24,13,24],[14,21,14,23],[15,21,15,23],[16,21,16,23],[17,21,17,23],[18,21,18,23]]}
[]
["Material Composition Declaration "]
["Supplier or Manufacturing Site Information"]
["Response Date",null,"Aug/13/2015","Contact Name",null,"Angela Le","Contact Title",null,"QS Section Manager",null,"Contact Phone",{"$nulls":5},"86-21-50802030",null,"Contact Email/Fax",null,"angela_le@giantec-semi.com"]
["Company Name",null,"Giantec ","Name of person certifying",null,"Frank zhou","Certifying Title",null,"QRA Director",null,"Certifying Phone",{"$nulls":5},"86-21-50802030",null,"Certifying Email",null,"Frank_Zhou@giantec-semi.com"]
["Part Category",null,"IC","Part Name","EEPROM",null,"Package Family",null,"PDIP",null,"Pin count",{"$nulls":5},8,null,"Part wight (mg)",null,{"$f":"SUM(E15:E20)","v":{"v":517,"d":"517.00"}}]
["Part Number(s)",null,"PDIP","GT24C256C-2PLI、GT25C64-2PLI、GT93C46A-2PLI、GT93C46A-2PLI、GT93C66A-2PLI、GT93C86-2PLI、GT24C08A-2PLI、GT24C08A-2PLI、GT24C64-2PLI、GT24C64-2PLI、GT24C04-2PLI、GT24C04A-2PLI、GT24C04A-2PLI、GT24C16A-2PLI、GT24C16-2PLI、GT24C128B-2PLI、GT24C128B-2PLI、GT24C02A-2PLI、GT24C32B-2PLI、GT25C256-2PLI "]
["Alternative Recommended Item",null,null,"NA",null,"Alternative Item Name",null,"NA",null,"Availability Date ",{"$nulls":5},"NA","Alternative Part Comments",null,null,"NA"]
["Manufacturing Process Information"]
["Terminal Plating/Grid Array Material Composition",null,null,2,"Terminal Plating Thickness (um)",null,null,"7.5~17","Terminal Base Alloy",null,"C194",{"$nulls":4},"J-STD-020 Moisture",null,1,"Maximum Reflow Temp. ",null,"260 C"]
["Maximum temp. duration (sec)",null,null,10,"Maximum cycles for Reflow",null,null,3,"Comment"]
[]
[null,null,"                  Homogeneous Material ",null,null,"3rd Party Analytical Testing result (ppm)",{"$nulls":10},"Compliance (Yes/No)",null,"                 3rd Party Analytical Testing",{"$nulls":5},"MSDS"]
["Item","Name","Vender","Type","Weight (mg)","Cd ","Pb","Hg","Cr-VI","PBBs","PBDEs","DEHP","BBP","DBP","DIBP","RoHS","JIG Level A","Exempt","Lab. Name","Report No.","Date","1.RoHS","2.Halogen","3.PFOS/PFOA"]
[1,"Lead Frame","华龙","A194",{"v":148,"d":"148.00"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","SHAEC2207011203","2022-06-20"]
[2,"Die attach paste","长春永固","S210",{"v":1,"d":"1.00"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","TSNEC2201361301\nTSNEC2201361302\nTSNEC2201361303","2022-06-10"]
[3,"Cu Wire","MKE","PdCu",{"v":1,"d":"1.00"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","CANEC2208861607","2022-05-17"]
[4,"Molding compound","HHCK","EMG-350",{"v":358,"d":"358.00"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","CTI","SHAEC22003930123","2022-12-29"]
[5,"Lead finish \n(Matte Sn) on leadframe","HTBJ\n","Sn",{"v":7,"d":"7.00"},"N.D.",16,"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","TSNEC2201040501","2022-05-11"]
[6,"DIE","SMIC","Silicon",{"v":2,"d":"2.00"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","CTI","A2220522292101005","2023-01-05"]
[]
[null,"Giantec fill in"]
[null,"Supplier or Manufacturing Site fill in",{"$nulls":15},"Final Compliance Judgement of RoHS",{"$nulls":3},"Yes",null,null,"No"]

{"sheet":"SCD","index":1,"n_rows":36,"n_cols":17,"rows_kept":36,"merged":[[0,0,0,18],[1,0,1,18],[4,12,4,13],[5,7,5,18],[6,15,6,18],[7,0,7,18],[11,12,12,12],[11,13,12,13],[11,19,12,19],[13,0,32,0],[13,1,18,1],[13,2,18,2],[13,3,18,3],[13,4,18,4],[19,1,21,1],[19,2,21,2],[19,3,21,3],[19,4,21,4],[22,1,23,1],[22,2,23,2],[22,3,23,3],[22,4,23,4],[24,1,28,1],[24,2,28,2],[24,3,28,3],[24,4,28,4],[29,1,30,1],[29,2,30,2],[29,3,30,3],[29,4,30,4],[31,1,32,1],[31,2,32,2],[31,3,32,3],[31,4,32,4]]}
["Substance Composition Declaration "]
["Supplier or Manufacturing Site Information"]
["Response Date",null,{"$f":"MCD!C4","v":"Aug/13/2015"},"Contact Name",null,{"$f":"MCD!F4","v":"Angela Le"},"Contact Title",null,{"$f":"MCD!I4","v":"QS Section Manager"},null,"Contact Phone",null,{"$f":"MCD!Q4","v":"86-21-50802030"},null,"Contact Email/Fax",null,{"$f":"MCD!U4","v":"angela_le@giantec-semi.com"}]
["Company Name",null,{"$f":"MCD!C5","v":"Giantec "},"Name of person certifying",null,{"$f":"MCD!F5","v":"Frank zhou"},"Certifying Title",null,{"$f":"MCD!I5","v":"QRA Director"},null,"Certifying Phone",null,{"$f":"MCD!Q5","v":"86-21-50802030"},null,"Certifying Email",null,{"$f":"MCD!U5","v":"Frank_Zhou@giantec-semi.com"}]
["Part Category",null,{"$f":"MCD!C6","v":"IC"},"Part Name",{"$f":"MCD!E6","v":"EEPROM"},null,"Package Family",null,{"$f":"MCD!I6","v":"PDIP"},null,"Pin count",null,{"$f":"MCD!Q6","v":8},null,"Part wight (mg)",null,{"$f":"MCD!U6","v":{"v":517,"d":"517.00"}}]
["Part Number(s)",null,{"$f":"MCD!C7","v":"PDIP"},{"$f":"MCD!D7","v":"GT24C256C-2PLI、GT25C64-2PLI、GT93C46A-2PLI、GT93C46A-2PLI、GT93C66A-2PLI、GT93C86-2PLI、GT24C08A-2PLI、GT24C08A-2PLI、GT24C64-2PLI、GT24C64-2PLI、GT24C04-2PLI、GT24C04A-2PLI、GT24C04A-2PLI、GT24C16A-2PLI、GT24C16-2PLI、GT24C128B-2PLI、GT24C128B-2PLI、GT24C02A-2PLI、GT24C32B-2PLI、GT25C256-2PLI "}]
["Alternative Recommended Item",null,null,{"$f":"MCD!D8","v":"NA"},null,"Alternative Item Name",null,{"$f":"MCD!H8","v":"NA"},null,"Availability Date ",null,{"$f":"MCD!P8","v":"NA"},"Alternative Part Comments",null,null,{"$f":"MCD!T8","v":"NA"}]
["Manufacturing Process Information"]
["Terminal Plating/Grid Array Material Composition",null,null,{"$f":"MCD!D10","v":2},"Terminal Plating Thickness (um)",null,null,{"$f":"MCD!H10","v":"7.5~17"},"Terminal Base Alloy",null,{"$f":"MCD!K10","v":"C194"},"J-STD-020 Moisture",null,{"$f":"MCD!R10","v":1},"Maximum Reflow Temp. ",null,{"$f":"MCD!U10","v":"260 C"}]
["Maximum temp. duration (sec)",null,null,{"$f":"MCD!D11","v":10},"Maximum cycles for Reflow",null,null,{"$f":"MCD!H11","v":3},"Comment",null,{"$f":"MCD!K11","v":0}]
[]
[null,null,"                  Homogeneous Material ",null,null,"JIG",null,null,"                   Substance",{"$nulls":3},"物质重量J/E%","均质重量\n百分比"]
["Item","Name","Vender","Type","Weight (mg)","Level","Category","Name","CAS","Weight (mg)","PPM","Exempt"]
["PDIP","Lead Frame","华龙","A194",148,"/",null,"Copper","7440-50-8",143.0124,{"$f":"J14/517*1000000","v":{"v":276619.72920696327,"d":"276,620 "}},"No",{"v":0.9663,"d":"96.630%"},{"$f":"J14/517","v":{"v":0.27661972920696326,"d":"27.66%"}}]
[{"$nulls":5},"/",null,"Iron ","7439-89-6",3.256,{"$f":"J15/517*1000000","v":{"v":6297.872340425532,"d":"6,298 "}},"No",{"v":0.022,"d":"2.200%"},{"$f":"J15/517","v":{"v":0.006297872340425532,"d":"0.63%"}}]
[{"$nulls":5},"/",null,"Phosphorus","7723-14-0",0.0962,{"v":186.07350096711798,"d":"186 "},"No",{"v":0.00065,"d":"0.065%"},{"v":1.8607350096711797E-4,"d":"0.02%"}]
[{"$nulls":5},"/",null,"Zinc","7440-66-6",0.148,{"v":286.26692456479685,"d":"286 "},"No",{"v":1E-3,"d":"0.100%"},{"v":2.8626692456479687E-4,"d":"0.03%"}]
[{"$nulls":5},"/",null,"Lead","7439-92-1",0.0074,{"v":14.313346228239846,"d":"14 "},"No",{"v":5e-05,"d":"0.005%"},{"v":1.4313346228239846E-5,"d":"0.00%"}]
[{"$nulls":5},"/",null,"Silver ","7440-22-4",1.48,{"v":2862.669245647969,"d":"2,863 "},"No",{"v":0.01,"d":"1.000%"},{"v":2.862669245647969E-3,"d":"0.29%"}]
[null,"Die attach paste","Yongoo","S210",{"v":1,"d":"1.000"},"/",null,"Silver","7440-22-4",0.72,{"v":1392.6499032882011,"d":"1,393 "},"No",{"v":0.72,"d":"72.000%"},{"v":1.3926499032882011E-3,"d":"0.14%"}]
[{"$nulls":5},"/",null,"Epoxy resin","Proprietary",0.23,{"v":444.8742746615087,"d":"445 "},"No",{"v":0.23,"d":"23.000%"},{"v":4.448742746615087E-4,"d":"0.04%"}]
[{"$nulls":5},"/",null,"Curing agent & hardener","Proprietary",0.05,{"v":96.71179883945842,"d":"97 "},"No",{"v":0.05,"d":"5.000%"},{"v":9.6711798839458425E-5,"d":"0.01%"}]
[null,"Cu WireWire","MKE","PdCu",{"v":1,"d":"1.000"},"/",null,"Cu","7440-50-8",0.97,{"v":1876.208897485493,"d":"1,876 "},"No",{"v":0.97,"d":"97.000%"},{"v":1.8762088974854931E-3,"d":"0.19%"}]
[{"$nulls":5},"/",null,"Pd","7440-05-3",0.03,{"v":58.02707930367505,"d":"58 "},"No",{"v":0.03,"d":"3.000%"},{"v":5.8027079303675048E-5,"d":"0.01%"}]
[null,"Mold Compound","HHCK","EMG-350",{"v":358,"d":"358.000"},"/",null,"Silica","7631-86-9",280.672,{"v":542885.8800773695,"d":"542,886 "},"No",{"v":0.784,"d":"78.40%"},{"v":0.5428858800773695,"d":"54.29%"}]
[{"$nulls":5},"/",null,"Epoxy Resin","29690-82-2",39.38,{"v":76170.21276595745,"d":"76,170 "},"No",{"v":0.11,"d":"11.00%"},{"v":0.07617021276595745,"d":"7.62%"}]
[{"$nulls":5},"/",null,"Phenol Resin","9003-35-4",25.060000000000002,{"v":48471.953578336565,"d":"48,472 "},"No",{"v":0.07,"d":"7.00%"},{"v":0.048471953578336564,"d":"4.85%"}]
[{"$nulls":5},"/",null,"Fire Retardant","1309-42-8",10.74,{"v":20773.694390715667,"d":"20,774 "},"No",{"v":0.03,"d":"3.00%"},{"v":0.020773694390715667,"d":"2.08%"}]
[{"$nulls":5},"/",null,"Carbon black","1333-86-4",2.148,{"v":4154.738878143134,"d":"4,155 "},"No",{"v":0.006,"d":"0.60%"},{"v":4.1547388781431336E-3,"d":"0.42%"}]
[null,"Plating","HTBJ\n","Sn",{"v":7,"d":"7.000"},"/",null,"Sn","7440-31-5",6.9993,{"v":13538.297872340425,"d":"13,538 "},"No",{"v":0.9999,"d":"99.990%"},{"v":0.013538297872340425,"d":"1.35%"}]
[{"$nulls":5},"/",null,"Others","/",0.0007,{"v":1.3539651837524178,"d":"1 "},"No",{"v":1E-4,"d":"0.010%"},{"v":1.3539651837524178E-6,"d":"0.00%"}]
[null,"DIE","SMIC","Si/Al",{"v":2,"d":"2.000"},"/",null,"Silicon ","7440-21-3",{"$f":"M32*E32","v":1.9958},{"v":3860.3481624758224,"d":"3,860 "},"No",{"v":0.9979,"d":"99.79%"},{"v":3.8603481624758223E-3,"d":"0.39%"}]
[{"$nulls":5},"/",null,"others","Trade Secret",{"$f":"M33*E32","v":4.1999999999999815E-3},{"v":8.12379110251447,"d":"8 "},"No",{"$f":"1-M32","v":{"v":2.0999999999999908E-3,"d":"0.21%"}},{"v":8.12379110251447e-06,"d":"0.00%"}]
[]
[null," Giantec fill in"]
[null,"Supplier or Manufacturing Site fill in"]

{"sheet":"Abbreviations","index":2,"n_rows":51,"n_cols":5,"rows_kept":51}
["Termination Material Composition:",null,null,"Leadframe (Underplate) Material:"]
["Value","Description",null,"Value","Description"]
["Pure matte tin","100% Sn (matte) - no Ni barrier or annealing (Heat treatment)",null,"Alloy 42","Iron-based leadframe material"]
["Pure matte tin – annealed","100% Sn (matte), annealed is a heat treatment (e.g. 150°C for 1 hour)",null,"Copper","Cu, C194, C151, C7025"]
["Pure matte tin – reflowed","100% Sn (matte), reflowed indicates plating was completely melted after application",null,"Beryllium Copper","Be/Cu"]
["Pure matte tin - Ni barrier","100% Sn (matte), a nickel layer is added between the plating and base metal",null,"Brass","Cu/Zn alloy"]
["Pure matte tin - Ag barrier","100% Sn (matte), a silver layer is added between the plating and base metal",null,"Phosphor Bronze","P-Bronze"]
["Pure matte tin – fused","100% Sn (matte), fusing is a reflow operation in a hot oil bath",null,"Nickel","Ni (Used as barrier layer)"]
["Pure matte tin - reflowed over Nickel barrier","100% Sn (matte), reflowed over a nickel layer",null,"Kovar","Iron/Nickel based material"]
["Pure bright tin","100% Sn (bright) - no Ni barrier or annealing (Heat treatment)",null,"Other - please give details in Comments","To specify on Comment column"]
["Pure bright tin – annealed","100% Sn (bright), annealed is a heat treatment (e.g. 150°C for 1 hour)"]
["Pure bright tin – reflowed","100% Sn (bright), reflowed indicates plating was completely melted after application",null,"RoHS Exemptions:"]
["Pure bright tin - Ni barrier","100% Sn (bright), a nickel layer is added between the plating and base metal",null,"Value","Description"]
["Pure bright tin - Ag barrier","100% Sn (bright), a silver layer is added between the plating and base metal",null,1,"Mercury in compact fluorescent lamps not exceeding 5 mg per lamp"]
["Pure bright tin – fused","100% Sn (bright), fusing is a reflow operation in a hot oil bath",null,"2a","Mercury in straight fluorescent lamps for general purposes not exceeding halophosphate 10mg"]
["Pure bright tin - reflowed over Nickel barrier","100% Sn (bright), reflowed over a nickel layer",null,"2b","Mercury in straight fluorescent lamps for general purposes not exceeding triphosphate with normal lifetime 5 mg"]
["Semi-matte tin","100% Sn, material properties fall in between matte and bright conditions",null,"2c","Mercury in straight fluorescent lamps for general purposes not exceeding triphosphate with long lifetime 8 mg"]
["Nickel/Palladium/Gold","Ni/Pd/Au",null,3,"Mercury in straight fluorescent lamps for special purposes"]
["Nickel/Palladium","Ni/Pd",null,4,"Mercury in other lamps not specifically mentioned in this list"]
["Tin/Silver/Copper","Sn/Ag/Cu",null,5,"Lead in glass of cathode ray tubes, electronic components and fluorescent tubes"]
["Hot Dipped Tin/Silver/Copper","Sn/Ag/Cu applied in a molten tin bath process",null,"6a","Lead as an alloying element in steel containing up to 0.35% lead by weight"]
["Tin/Silver","Sn/Ag",null,"6b","Lead as an alloying element in aluminium containing up to 0.40% lead by weight"]
["Hot Dipped Tin/Silver","Sn/Ag applied in a molten tin bath process",null,"6c","Lead as a copper alloy containing up to 4.0% lead by weight"]
["Tin/Copper","Sn/Cu",null,"7a","Lead in high melting temperature type solders (i.e. lead-based solder alloys containing 85 % by weight or more lead)"]
["Hot Dipped Tin/Copper","Sn/Cu applied in a molten tin bath process",null,"7c","Lead in electronic ceramic parts (e.g. piezoelectronic devices)"]
["Tin/Copper – annealed","Sn/Cu, annealed is a heat treatment (e.g. 150°C for 1 hour)",null,8,"Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations"]
["Tin/Lead","Sn/Pb",null,9,"Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators"]
["Tin/Lead/Silver","Sn/Pb/Ag",null,"9a","DecaBDE in polymeric applications"]
["Nickel/Gold","Ni/Au",null,"9b","Lead in lead-bronze bearing shells and bushes"]
["Tin/Bismuth","Sn/Bi",null,11,"Lead used in compliant pin connector systems"]
["Silver/Palladium","Ag/Pd",null,12,"Lead as a coating material for a thermal conduction module c-ring"]
["Silver/Palladium - Ni barrier","Ag/Pd, a nickel layer is added between the plating and base metal",null,"13a","Lead in optical and filter glass"]
["Silver - Ni barrier","100% Ag, a nickel layer is added between the plating and base metal",null,"13b","Cadmium in optical and filter glass"]
["Gold","100% Au",null,14,"Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight"]
["Gold over Nickel","Au plated over a Ni-barrier layer",null,15,"Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages"]
["Nickel","100% Ni",null,"N/A","Not Applicable"]
["Immersion Silver","Imm. Ag"]
["Immersion Tin","Imm. Sn"]
["Electroplated Silver","100% Ag",null,"Moisture Sensitivity:"]
["OSP","Organic polymer over copper",null,"Value","Description"]
["Hot Dipped Tin","100% Sn applied in a molten tin bath process",null,1]
["Zinc","100% Zn or Zn-alloy",null,2]
["Tin/Zinc","Sn plated over Zn",null,"2a"]
["Aluminum","100% Al",null,3]
["Indium alloy","In bearing alloy",null,4]
["Tin/Copper HASL","Sn/Cu Hot Air Solder Leveled",null,5]
["ENIG","Electroless Nickel Immersion Gold",null,"5a"]
["ENEPIG","Electroless Nickel/Electroless Palladium/Immersion Gold",null,6]
["Other - Please give details in Comments","To  specify on Comment column",null,"ANR","Affected (by moisture exposure), no JEDEC rating"]
[{"$nulls":3},"NMS","Not Moisture Sensitive"]
[{"$nulls":3},"IPC/JEDEC J-STD-020C; go to www.jedec.org"]