{"text_format":"3","workbook":"xls","n_sheets":4,"sheets":["MCD","SCD","Abbreviations","Sheet1"],"not_rendered":{"images":15,"external_links":2,"defined_names":5,"comments":20},"read":"whole","date_system":"1900","formulas":"cached_only"}

{"sheet":"MCD","index":0,"n_rows":22,"n_cols":25,"rows_kept":22,"merged":[[0,0,0,24],[1,0,1,24],[2,17,2,22],[3,8,3,9],[7,0,7,24],[11,5,11,14],[11,24,12,24],[13,21,13,23],[14,21,14,23],[15,21,15,23],[16,21,16,23],[17,21,17,23],[18,21,18,23]],"flags":["formulas_cached_only"]}
["Material Composition Declaration "]
["Supplier or Manufacturing Site Information"]
["Contact Name",null,"Yun Ding","Contact Title",null,"QS Engineer",null,"Contact Phone",null,"86-21-50802030",{"$nulls":5},"Contact Email/Fax",null,"yun_ding@giantec-semi.com"]
["Company Name",null,"Giantec ","Name of person certifying",null,"Frank zhou","Certifying Title",null,"QRA Director",null,"Certifying Phone",{"$nulls":5},"86-21-50802030",null,"Certifying Email",null,"Frank_Zhou@giantec-semi.com"]
["Part Category",null,"IC","Part Name","EEPROM",null,"Package Family",null,"SOP",null,"Pin count",{"$nulls":5},8,null,"Part weight (mg)",null,{"v":85.6927153342686,"d":"85.69"}]
["Part Number(s)",null,"GT24CXX-XGLX, GT25CXX-XGLX, GT34CXX-XGLX，GT93CXX-XGLX,"]
["Alternative Recommended Item",null,null,"NA",null,"Alternative Item Name",null,"NA",null,"Availability Date ",{"$nulls":5},"NA","Alternative Part Comments",null,null,"NA"]
["Manufacturing Process Information"]
["Terminal Plating/Grid Array Material Composition",null,null,2,"Terminal Plating Thickness (um)",null,null,"7.5~17","Terminal Base Alloy",null,"C194",{"$nulls":4},"J-STD-020 Moisture",null,1,"Maximum Reflow Temp. ",null,"260 C"]
["Maximum temp. duration (sec)",null,null,10,"Maximum cycles for Reflow",null,null,3,"Comment"]
[]
[null,null,"                  Homogeneous Material ",null,null,"3rd Party Analytical Testing result (ppm)",{"$nulls":10},"Compliance (Yes/No)",null,null,"                 3rd Party Analytical Testing",{"$nulls":4},"MSDS"]
["Item","Name","Vender","Type","Weight (mg)","Cd ","Pb","Hg","Cr-VI","PBBs","PBDEs","DEHP","BBP","DBP","DIBP","RoHS","JIG Level A","Exempt","Lab. Name","Report No.","Date","1.RoHS","2.Halogen","3.PFOS/PFOA"]
[1,"Leadframe","MITSUI","C194+Ag",{"v":37.13762185,"d":"37.14"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","TSNEC2201040301","2022-05-11"]
[2,"Die attach paste","SHOWA DENKO","EN4900G*",{"v":0.0426506132,"d":"0.04"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","ETR22701026M17","2022-07-12"]
[3,"Copper wire ","Nippon","EX-SERIES",{"v":0.0303090454686007,"d":"0.03"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","ETR23101251","2023-01-16"]
[4,"Molding compound","SD","CEL-9240HF",{"v":47.536125,"d":"47.54"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","SHAEC22003258323\nSHAEC22003258324","2022-11-23"]
[5,"Lead finish \n(Matte Sn) on leadframe","Tinking","Sn 99.99%",{"v":0.5240462976,"d":"0.52"},"N.D.",53,"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","SHAEC22002018506","2022-10-12"]
[6,"DIE","SMIC","Silicon",{"v":0.421962528,"d":"0.42"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","CTI","A2220522292101005","2023-01-05"]
[]
[null,"Giantec fill in"]
[null,"Supplier or Manufacturing Site fill in",{"$nulls":15},"Final Compliance Judgement of GP",{"$nulls":3},"Yes",null,null,"No"]

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["Substance Composition Declaration "]
["Supplier or Manufacturing Site Information"]
["Response Date",null,"NA","Contact Name",null,"Yun Ding","Contact Title",null,"QS Engineer",null,"Contact Phone",null,"86-21-50802030",null,"Contact Email/Fax",null,"yun_ding@giantec-semi.com"]
["Company Name",null,"Giantec ","Name of person certifying",null,"Frank zhou","Certifying Title",null,"QRA Director",null,"Certifying Phone",null,"86-21-50802030",null,"Certifying Email",null,"Frank_Zhou@giantec-semi.com"]
["Part Category",null,"IC","Part Name","EEPROM",null,"Package Family",null,"SOP",null,"Pin count",null,8,null,"Part wight (mg)",null,{"v":85.6927153342686,"d":"85.69"}]
["Part Number(s)",null,"GT24CXX-XGLX, GT25CXX-XGLX, GT34CXX-XGLX，GT93CXX-XGLX,"]
["Alternative Recommended Item",null,null,"NA",null,"Alternative Item Name",null,"NA",null,"Availability Date ",null,"NA","Alternative Part Comments",null,null,"NA"]
["Manufacturing Process Information"]
["Terminal Plating/Grid Array Material Composition",null,null,2,"Terminal Plating Thickness (um)",null,null,"7.5~17","Terminal Base Alloy",null,"C194","J-STD-020 Moisture",null,1,"Maximum Reflow Temp. ",null,"260 C"]
["Maximum temp. duration (sec)",null,null,10,"Maximum cycles for Reflow",null,null,3,"Comment"]
[]
[null,null,"                  Homogeneous Material ",null,null,"JIG",null,null,"                   Substance",{"$nulls":3},"J/E%","%"]
["Item","Name","Vender","Type","Weight (mg)","Level","Category","Name","CAS","Weight (mg)","PPM","Exempt"]
["SOP8","Leadframe","MITSUI","C194+Ag",{"v":37.13762185,"d":"37.14"},"Other",null,"Copper(Cu)","7440-50-8 ",35.837805085250004,{"v":418212.9711429325,"d":"418,213"},"No",{"v":0.965,"d":"96.50%"},{"v":0.4182129711429325,"d":"41.821%"}]
[{"$nulls":5},"Other",null,"Iron(Fe)","7439-89-6",0.8467377781800001,{"v":9881.094033221618,"d":"9,881"},"No",{"v":0.0228,"d":"2.28%"},{"v":0.009881094033221618,"d":"0.988%"}]
[{"$nulls":5},"Other",null,"Phosphorus(P)","7723-14-0",0.011141286555,{"v":130.01439517396864,"d":"130"},"No",{"v":0.0003,"d":"0.03%"},{"v":0.00013001439517396863,"d":"0.013%"}]
[{"$nulls":5},"Other",null,"Zinc(Zn)","7440-66-6",0.055706432775,{"v":650.0719758698433,"d":"650"},"No",{"v":0.0015,"d":"0.15%"},{"v":0.0006500719758698433,"d":"0.065%"}]
[{"$nulls":5},"Other",null,"Silver(Ag)","7440-22-4",0.38623126724,{"v":4507.165699364246,"d":"4,507"},"No",{"v":0.0104,"d":"1.04%"},{"v":0.004507165699364247,"d":"0.451%"}]
[null,"Die attach paste","SHOWA DENKO","EN4900G*",{"v":0.0426506132,"d":"0.04"},"Other",null,"Silver","7440-22-4",0.031774706834,{"v":370.7982260808728,"d":"371"},"No",{"v":0.745,"d":"74.50%"},{"v":0.00037079822608087276,"d":"0.037%"}]
[{"$nulls":5},"Other",null,"Acrylic resin","Trade Secret",0.0036253021220000003,{"v":42.30583787499891,"d":"42"},"No",{"v":0.08500000000000002,"d":"8.50%"},{"v":4.230583787499891e-05,"d":"0.004%"}]
[{"$nulls":5},"Other",null,"Polybutadiene derivative","Trade Secret",0.001706024528,{"v":19.90862958823478,"d":"20"},"No",{"v":0.04,"d":"4.00%"},{"v":1.990862958823478e-05,"d":"0.002%"}]
[{"$nulls":5},"Other",null,"Butadiene copolymer","Trade Secret",0.000853012264,{"v":9.95431479411739,"d":"10"},"No",{"v":0.02,"d":"2.00%"},{"v":9.769793375250505e-06,"d":"0.001%"}]
[{"$nulls":5},"Other",null,"Epoxy resin","Trade Secret",0.00106626533,{"v":12.442893492646737,"d":"12"},"No",{"v":0.025,"d":"2.50%"},{"v":1.2442893492646737e-05,"d":"0.001%"}]
[{"$nulls":5},"Other",null,"Acrylate","Trade Secret",0.002345783726,{"v":27.37436568382282,"d":"27"},"No",{"v":0.05499999999999999,"d":"5.50%"},{"v":2.737436568382282e-05,"d":"0.003%"}]
[{"$nulls":5},"Other",null,"Peroxide","Trade Secret",0.000426506132,{"v":4.977157397058695,"d":"5"},"No",{"v":0.01,"d":"1.00%"},{"v":4.977157397058695e-06,"d":"0.000%"}]
[{"$nulls":5},"Other",null,"Additive","Trade Secret",0.000853012264,{"v":9.95431479411739,"d":"10"},"No",{"v":0.02,"d":"2.00%"},{"v":9.95431479411739e-06,"d":"0.001%"}]
[null,"Copper wire ","Nippon ","EX-SERIES",{"v":0.0303090454686007,"d":"0.03"},"Other",null,"Cu","7440-50-8",0.0297634826501659,{"v":347.32803755914426,"d":"347"},"No",{"v":0.982,"d":"98.20%"},{"v":0.00034732803755914426,"d":"0.035%"}]
[{"$nulls":5},"Other",null,"Palladium","7440-05-03",0.000545562818434813,{"v":6.36650170678676,"d":"6"},"No",{"v":0.018,"d":"1.80%"},{"v":6.36650170678676e-06,"d":"0.001%"}]
[null,"Molding compound","SD","CEL-9240HF",{"v":47.536125,"d":"47.54"},"Other",null,"Epoxy resin1","Trade secret",{"v":1.188403125,"d":"1.1884"},{"v":13868.193117283055,"d":"13,868 "},"No",{"v":0.025,"d":"2.50%"},{"v":0.013868193117283056,"d":"1.39%"}]
[{"$nulls":5},"Other",null,"Epoxy resin2","Trade secret",{"v":0.7130418749999999,"d":"0.7130"},{"v":8320.915870369834,"d":"8,321 "},"No",{"v":0.015,"d":"1.50%"},{"v":0.008320915870369833,"d":"0.83%"}]
[{"$nulls":5},"Other",null,"Hardener","Trade secret",{"v":0.02105273,"d":"0.0211"},{"v":277,"d":"277 "},"No",{"v":0.0005,"d":"0.05%"},{"v":0.0003,"d":"0.03%"}]
[{"$nulls":5},"Other",null,"Catalyst","Trade secret",{"v":1.6637643750000002,"d":"1.6638"},{"v":19415.47036419628,"d":"19,415 "},"No",{"v":0.035,"d":"3.50%"},{"v":0.01941547036419628,"d":"1.94%"}]
[{"$nulls":5},"Other",null,"Carbon black","1333-86-4",{"v":0.09507225,"d":"0.0951"},{"v":1109.4554493826445,"d":"1,109 "},"No",{"v":0.002,"d":"0.20%"},{"v":0.0011094554493826445,"d":"0.11%"}]
[{"$nulls":5},"Other",null,"Amorphous silica1","60676-86-0",38.0289,{"v":443782.1797530578,"d":"443,782 "},"No",{"v":0.8,"d":"80.00%"},{"v":0.4437821797530578,"d":"44.38%"}]
[{"$nulls":5},"Other",null,"Amorphous silica2","7631-86-7",{"v":5.8231753125,"d":"5.8232"},{"v":67954.14627468698,"d":"67,954 "},"No",{"v":0.1225,"d":"12.25%"},{"v":0.06795414627468697,"d":"6.80%"}]
[null,"Lead finish \n(Matte Sn) on leadframe","Tinking","Sn 99.99%",{"v":0.5240462976,"d":"0.52"},"Other",null,"Sn","7440-31-5",0.5240462976,{"v":6115.412442654077,"d":"6,115"},"No",{"v":1,"d":"100.00%"},{"v":0.0061,"d":"0.610%"}]
[null,"DIE","SMIC","Silicon",{"v":0.421962528,"d":"0.42"},"Other",null,"Silicon ","7440-21-3",0.42108315809164804,{"v":4913.87344244017,"d":"4,914"},"No",{"v":0.997916,"d":"99.79%"},{"v":0.00491,"d":"0.491%"}]
[{"$nulls":7},"Others","Trade Secret",0.0008793699083519894,{"v":10.261898049580516,"d":"10"},"No",{"v":0.0020839999999999748,"d":"0.21%"},{"v":1.0261898049580517e-05,"d":"0.001%"}]
[null," Giantec fill in"]
[null,"Supplier or Manufacturing Site fill in"]

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["Termination Material Composition:",null,null,"Leadframe (Underplate) Material:"]
["Value","Description",null,"Value","Description"]
["Pure matte tin","100% Sn (matte) - no Ni barrier or annealing (Heat treatment)",null,"Alloy 42","Iron-based leadframe material"]
["Pure matte tin – annealed","100% Sn (matte), annealed is a heat treatment (e.g. 150°C for 1 hour)",null,"Copper","Cu, C194, C151, C7025"]
["Pure matte tin – reflowed","100% Sn (matte), reflowed indicates plating was completely melted after application",null,"Beryllium Copper","Be/Cu"]
["Pure matte tin - Ni barrier","100% Sn (matte), a nickel layer is added between the plating and base metal",null,"Brass","Cu/Zn alloy"]
["Pure matte tin - Ag barrier","100% Sn (matte), a silver layer is added between the plating and base metal",null,"Phosphor Bronze","P-Bronze"]
["Pure matte tin – fused","100% Sn (matte), fusing is a reflow operation in a hot oil bath",null,"Nickel","Ni (Used as barrier layer)"]
["Pure matte tin - reflowed over Nickel barrier","100% Sn (matte), reflowed over a nickel layer",null,"Kovar","Iron/Nickel based material"]
["Pure bright tin","100% Sn (bright) - no Ni barrier or annealing (Heat treatment)",null,"Other - please give details in Comments","To specify on Comment column"]
["Pure bright tin – annealed","100% Sn (bright), annealed is a heat treatment (e.g. 150°C for 1 hour)"]
["Pure bright tin – reflowed","100% Sn (bright), reflowed indicates plating was completely melted after application",null,"RoHS Exemptions:"]
["Pure bright tin - Ni barrier","100% Sn (bright), a nickel layer is added between the plating and base metal",null,"Value","Description"]
["Pure bright tin - Ag barrier","100% Sn (bright), a silver layer is added between the plating and base metal",null,1,"Mercury in compact fluorescent lamps not exceeding 5 mg per lamp"]
["Pure bright tin – fused","100% Sn (bright), fusing is a reflow operation in a hot oil bath",null,"2a","Mercury in straight fluorescent lamps for general purposes not exceeding halophosphate 10mg"]
["Pure bright tin - reflowed over Nickel barrier","100% Sn (bright), reflowed over a nickel layer",null,"2b","Mercury in straight fluorescent lamps for general purposes not exceeding triphosphate with normal lifetime 5 mg"]
["Semi-matte tin","100% Sn, material properties fall in between matte and bright conditions",null,"2c","Mercury in straight fluorescent lamps for general purposes not exceeding triphosphate with long lifetime 8 mg"]
["Nickel/Palladium/Gold","Ni/Pd/Au",null,3,"Mercury in straight fluorescent lamps for special purposes"]
["Nickel/Palladium","Ni/Pd",null,4,"Mercury in other lamps not specifically mentioned in this list"]
["Tin/Silver/Copper","Sn/Ag/Cu",null,5,"Lead in glass of cathode ray tubes, electronic components and fluorescent tubes"]
["Hot Dipped Tin/Silver/Copper","Sn/Ag/Cu applied in a molten tin bath process",null,"6a","Lead as an alloying element in steel containing up to 0.35% lead by weight"]
["Tin/Silver","Sn/Ag",null,"6b","Lead as an alloying element in aluminium containing up to 0.40% lead by weight"]
["Hot Dipped Tin/Silver","Sn/Ag applied in a molten tin bath process",null,"6c","Lead as a copper alloy containing up to 4.0% lead by weight"]
["Tin/Copper","Sn/Cu",null,"7a","Lead in high melting temperature type solders (i.e. lead-based solder alloys containing 85 % by weight or more lead)"]
["Hot Dipped Tin/Copper","Sn/Cu applied in a molten tin bath process",null,"7c","Lead in electronic ceramic parts (e.g. piezoelectronic devices)"]
["Tin/Copper – annealed","Sn/Cu, annealed is a heat treatment (e.g. 150°C for 1 hour)",null,8,"Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations"]
["Tin/Lead","Sn/Pb",null,9,"Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators"]
["Tin/Lead/Silver","Sn/Pb/Ag",null,"9a","DecaBDE in polymeric applications"]
["Nickel/Gold","Ni/Au",null,"9b","Lead in lead-bronze bearing shells and bushes"]
["Tin/Bismuth","Sn/Bi",null,11,"Lead used in compliant pin connector systems"]
["Silver/Palladium","Ag/Pd",null,12,"Lead as a coating material for a thermal conduction module c-ring"]
["Silver/Palladium - Ni barrier","Ag/Pd, a nickel layer is added between the plating and base metal",null,"13a","Lead in optical and filter glass"]
["Silver - Ni barrier","100% Ag, a nickel layer is added between the plating and base metal",null,"13b","Cadmium in optical and filter glass"]
["Gold","100% Au",null,14,"Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight"]
["Gold over Nickel","Au plated over a Ni-barrier layer",null,15,"Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages"]
["Nickel","100% Ni",null,"N/A","Not Applicable"]
["Immersion Silver","Imm. Ag"]
["Immersion Tin","Imm. Sn"]
["Electroplated Silver","100% Ag",null,"Moisture Sensitivity:"]
["OSP","Organic polymer over copper",null,"Value","Description"]
["Hot Dipped Tin","100% Sn applied in a molten tin bath process",null,1]
["Zinc","100% Zn or Zn-alloy",null,2]
["Tin/Zinc","Sn plated over Zn",null,"2a"]
["Aluminum","100% Al",null,3]
["Indium alloy","In bearing alloy",null,4]
["Tin/Copper HASL","Sn/Cu Hot Air Solder Leveled",null,5]
["ENIG","Electroless Nickel Immersion Gold",null,"5a"]
["ENEPIG","Electroless Nickel/Electroless Palladium/Immersion Gold",null,6]
["Other - Please give details in Comments","To  specify on Comment column",null,"ANR","Affected (by moisture exposure), no JEDEC rating"]
[{"$nulls":3},"NMS","Not Moisture Sensitive"]
[{"$nulls":3},"IPC/JEDEC J-STD-020C; go to www.jedec.org"]

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