{"text_format":"3","workbook":"xls","n_sheets":3,"sheets":["MCD","SCD","Abbreviations"],"not_rendered":{"images":18,"external_links":1,"defined_names":4,"comments":17},"read":"whole","date_system":"1900","formulas":"cached_only"}

{"sheet":"MCD","index":0,"n_rows":22,"n_cols":25,"rows_kept":22,"merged":[[0,0,0,24],[1,0,1,24],[3,8,3,9],[4,16,4,17],[5,7,5,24],[6,19,6,24],[7,0,7,24],[11,5,11,14],[11,18,11,23],[11,24,12,24],[13,21,13,23],[14,21,14,23],[15,21,15,23],[16,21,16,23],[17,21,17,23],[18,21,18,23]],"flags":["formulas_cached_only"]}
["Material Composition Declaration "]
["Supplier or Manufacturing Site Information"]
["Response Date",null,"23/7/2021","Contact Name",null,"Angela Le","Contact Title",null,"QS/DCC Engineer",null,"Contact Phone",{"$nulls":5},"86-21-50802030",null,"Contact Email/Fax",null,"angela_le@giantec-semi.com"]
["Company Name",null,"Giantec ","Name of person certifying",null,"Frank zhou","Certifying Title",null,"QRA Director",null,"Certifying Phone",{"$nulls":5},"86-21-50802030",null,"Certifying Email",null,"Frank_Zhou@giantec-semi.com"]
["Part Category",null,"IC","Part Name","EEPROM",null,"Package Family",null,"MSOP",null,"Pin count",{"$nulls":5},8,null,"Part wight (mg)",null,{"v":27,"d":"27.00"}]
["Part Number(s)",null,"MSOP"]
["Alternative Recommended Item",null,null,"NA",null,"Alternative Item Name",null,"NA",null,"Availability Date ",{"$nulls":5},"NA","Alternative Part Comments",null,null,"NA"]
["Manufacturing Process Information"]
["Terminal Plating/Grid Array Material Composition",null,null,2,"Terminal Plating Thickness (um)",null,null,"7.5~17","Terminal Base Alloy",null,"A194",{"$nulls":4},"J-STD-020 Moisture",null,1,"Maximum Reflow Temp. ",null,"260 C"]
["Maximum temp. duration (sec)",null,null,10,"Maximum cycles for Reflow",null,null,3,"Comment"]
[]
[null,null,"                  Homogeneous Material ",null,null,"3rd Party Analytical Testing result (ppm)",{"$nulls":10},"Compliance (Yes/No)",null,"                 3rd Party Analytical Testing",{"$nulls":5},"MSDS"]
["Item","Name","Vender","Type","Weight (mg)","Cd ","Pb","Hg","Cr-VI","PBBs","PBDEs","DEHP","BBP","DBP","DIBP","RoHS","JIG Level A","Exempt","Lab. Name","Report No.","Date","1.RoHS","2.Halogen","3.PFOS/PFOA"]
[1,"DIE","SMIC","Silicon",{"v":1,"d":"1.00"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","CTI","A2220522292101005","2023-01-05"]
[2,"Leadframe","AAM","A194",{"v":7.6,"d":"7.60"},"ND",18.8,"ND","ND","ND","ND","N.D.","N.D.","N.D.","N.D.","YES","Yes","No","SGS","EKR22801838\nEKR22801843","2022-09-06"]
[3,"Die attach paste","Henkel","8200T",{"v":1,"d":"1.00"},"ND","ND","ND","ND","ND","ND","N.D.","N.D.","N.D.","N.D.","YES","Yes","No","SGS","SHAEC2207860406\nSHAEC2207860408\nSHAEC2207860407","2022-06-28"]
[4,"Copper Wire","MKE","PdCu",{"v":0.7,"d":"0.70"},"ND","ND","ND","ND","ND","ND","N.D.","N.D.","N.D.","N.D.","YES","Yes","No","SGS","CANEC2208861607","2022-05-17"]
[5,"Molding compound","SD Materials ","CEL-9220HF",{"v":14.7,"d":"14.70"},"ND","ND","ND","ND","ND","ND","N.D.","N.D.","N.D.","N.D.","YES","Yes","No","SGS","SHAEC22003258315\nSHAEC22003258316","2022-11-23"]
[6,"Lead finish \n(Matte Sn) on leadframe","Aisen","Tin",{"v":2,"d":"2.00"},"ND",9,"ND","ND","ND","ND","N.D.","N.D.","N.D.","N.D.","YES","Yes","No","SGS","SHAEC2207294305","2022-06-27"]
[]
[null,"Giantec fill in"]
[null,"Supplier or Manufacturing Site fill in",{"$nulls":15},"Final Compliance Judgement of RoHS",{"$nulls":3},"Yes",null,null,"No"]

{"sheet":"SCD","index":1,"n_rows":38,"n_cols":17,"rows_kept":38,"merged":[[0,0,0,18],[1,0,1,18],[4,12,4,13],[5,7,5,18],[6,15,6,18],[7,0,7,18],[11,12,12,12],[11,13,12,13],[11,19,12,19],[13,0,34,0],[13,1,18,1],[13,2,18,2],[13,3,18,3],[13,4,18,4],[19,1,21,1],[19,2,21,2],[19,3,21,3],[19,4,21,4],[22,1,23,1],[22,2,23,2],[22,3,23,3],[22,4,23,4],[24,1,30,1],[24,2,30,2],[24,3,30,3],[24,4,30,4],[31,1,32,1],[31,2,32,2],[31,3,32,3],[31,4,32,4],[33,1,34,1],[33,2,34,2],[33,3,34,3],[33,4,34,4]],"flags":["formulas_cached_only"]}
["Substance Composition Declaration "]
["Supplier or Manufacturing Site Information"]
["Response Date",null,"23/7/2021","Contact Name",null,"Angela Le","Contact Title",null,"QS/DCC Engineer",null,"Contact Phone",null,"86-21-50802030",null,"Contact Email/Fax",null,"angela_le@giantec-semi.com"]
["Company Name",null,"Giantec ","Name of person certifying",null,"Frank zhou","Certifying Title",null,"QRA Director",null,"Certifying Phone",null,"86-21-50802030",null,"Certifying Email",null,"Frank_Zhou@giantec-semi.com"]
["Part Category",null,"IC","Part Name","EEPROM",null,"Package Family",null,"MSOP",null,"Pin count",null,8,null,"Part wight (mg)",null,{"v":27,"d":"27.00"}]
["Part Number(s)",null,"MSOP"]
["Alternative Recommended Item",null,null,"NA",null,"Alternative Item Name",null,"NA",null,"Availability Date ",null,"NA","Alternative Part Comments",null,null,"NA"]
["Manufacturing Process Information"]
["Terminal Plating/Grid Array Material Composition",null,null,2,"Terminal Plating Thickness (um)",null,null,"7.5~17","Terminal Base Alloy",null,"A194","J-STD-020 Moisture",null,1,"Maximum Reflow Temp. ",null,"260 C"]
["Maximum temp. duration (sec)",null,null,10,"Maximum cycles for Reflow",null,null,3,"Comment",null,0]
[]
[null,null,"                  Homogeneous Material ",null,null,"JIG",null,null,"                   Substance",{"$nulls":3},"均质物质重量J/E%","物质占总重量\n百分比"]
["Item","Name","Vender","Type","Weight (mg)","Level","Category","Name","CAS","Weight (mg)","PPM","Exempt"]
["MSOP","Leadframe","AAM","A194",{"v":7.6,"d":"7.60"},"Other",null,"Cu","7440-50-8 ",7.2880199999999995,{"v":269926.6666666666,"d":"269,927 "},"No",{"v":0.95895,"d":"95.895%"},{"v":0.26992666666666665,"d":"26.99%"}]
[{"$nulls":5},"Other",null,"Fe","7439-89-6",0.19,{"v":7037.037037037037,"d":"7,037 "},"No",{"v":0.025,"d":"2.500%"},{"v":0.007037037037037037,"d":"0.70%"}]
[{"$nulls":5},"Other",null,"Pb","7439-92-1",0.00038,{"v":14.074074074074074,"d":"14 "},"No",{"v":5e-05,"d":"0.005%"},{"v":1.4074074074074075e-05,"d":"0.00%"}]
[{"$nulls":5},"Other",null,"P","7723-14-0",0.0076,{"v":281.48148148148147,"d":"281 "},"No",{"v":0.001,"d":"0.100%"},{"v":0.00028148148148148146,"d":"0.03%"}]
[{"$nulls":5},"Other",null,"Zn","7440-66-6",0.076,{"v":2814.814814814815,"d":"2,815 "},"No",{"v":0.01,"d":"1.000%"},{"v":0.0028148148148148147,"d":"0.28%"}]
[{"$nulls":5},"Other",null,"Ag","7440-22-4",0.038,{"v":1407.4074074074074,"d":"1,407 "},"No",{"v":0.005,"d":"0.500%"},{"v":0.0014074074074074073,"d":"0.14%"}]
[null,"Die attach paste","Henkel","8200T",{"v":1,"d":"1.00"},"Other",null,"Arcylate","Trade secret",0.3,{"v":11111.111111111111,"d":"11,111 "},"No",{"v":0.3,"d":"30.000%"},{"v":0.011111111111111112,"d":"1.11%"}]
[{"$nulls":5},"Other",null,"Curing agent & hardener","Trade secret",0.07,{"v":2592.592592592593,"d":"2,593 "},"No",{"v":0.07,"d":"7.000%"},{"v":0.002592592592592593,"d":"0.26%"}]
[{"$nulls":5},"Other",null,"Silver powder","7440-22-4",0.63,{"v":23333.333333333336,"d":"23,333 "},"No",{"v":0.63,"d":"63.000%"},{"v":0.023333333333333334,"d":"2.33%"}]
[null,"Copper Wire","MKE","Pd(20)",{"v":0.7,"d":"0.70"},"Other",null,"Cu","7440-50-8 ",0.6789999999999999,{"v":25148.148148148146,"d":"25,148 "},"No",{"v":0.97,"d":"97.000%"},{"v":0.025148148148148145,"d":"2.51%"}]
[{"$nulls":5},"Other",null,"other","Trade secret",0.020999999999999998,{"v":777.7777777777777,"d":"778 "},"No",{"v":0.03,"d":"3.000%"},{"v":0.0007777777777777777,"d":"0.08%"}]
[null,"Molding compound","SD Materials ","CEL-9220",{"v":14.7,"d":"14.70"},"Other",null,"Epoxy Resin 1","Trade secret",0.3675,{"v":13611.11111111111,"d":"13,611 "},"No",{"v":0.025,"d":"2.500%"},{"v":0.01361111111111111,"d":"1.36%"}]
[{"$nulls":5},"Other",null,"Epoxy Resin 2","Trade secret",0.3675,{"v":13611.11111111111,"d":"13,611 "},"No",{"v":0.025,"d":"2.500%"},{"v":0.01361111111111111,"d":"1.36%"}]
[{"$nulls":5},"Other",null,"Epoxy Resin 3","Trade secret",0.3675,{"v":13611.11111111111,"d":"13,611 "},"No",{"v":0.025,"d":"2.500%"},{"v":0.01361111111111111,"d":"1.36%"}]
[{"$nulls":5},"Other",null,"Hardener","Trade secret",0.44099999999999995,{"v":16333.333333333332,"d":"16,333 "},"No",{"v":0.03,"d":"3.000%"},{"v":0.01633333333333333,"d":"1.63%"}]
[{"$nulls":5},"Other",null,"Carbon black","1333-86-4",0.0147,{"v":544.4444444444445,"d":"544 "},"No",{"v":0.001,"d":"0.100%"},{"v":0.0005444444444444444,"d":"0.05%"}]
[{"$nulls":5},"Other",null,"Amorphous silica","60676-86-0",12.8478,{"v":475844.4444444444,"d":"475,844 "},"No",{"v":0.874,"d":"87.400%"},{"v":0.4758444444444444,"d":"47.58%"}]
[{"$nulls":5},"Other",null,"Crystal silica","14808-60-7",0.294,{"v":10888.888888888889,"d":"10,889 "},"No",{"v":0.02,"d":"2.000%"},{"v":0.010888888888888889,"d":"1.09%"}]
[null,"Lead finish \n(Matte Sn) on leadframe","Aisen","Tin",{"v":2,"d":"2.00"},"Other",null,"Sn","7440-31-5",1.9998,{"v":74066.66666666667,"d":"74,067 "},"No",{"v":0.9999,"d":"99.990%"},{"v":0.07406666666666667,"d":"7.41%"}]
[{"$nulls":5},"Other",null,"other ","Trade secret",0.0002,{"v":7.407407407407407,"d":"7 "},"No",{"v":0.0001,"d":"0.010%"},{"v":7.4074074074074075e-06,"d":"0.00%"}]
[null,"DIE","SMIC","Silicon",{"v":1,"d":"1.000"},"Other",null,"Silicon ","7440-21-3",0.997916,{"v":36959.851851851854,"d":"36,960 "},"No",{"v":0.997916,"d":"99.79%"},{"v":0.036959851851851855,"d":"3.70%"}]
[null,null,"SMIC","Si/Al",null,"Other",null,"other","Trade secret",0.0020839999999999748,{"v":77.18518518518424,"d":"77 "},"No",{"v":0.0020839999999999748,"d":"0.21%"},{"v":7.718518518518424e-05,"d":"0.01%"}]
[]
[null," Giantec fill in"]
[null,"Supplier or Manufacturing Site fill in"]

{"sheet":"Abbreviations","index":2,"n_rows":51,"n_cols":5,"rows_kept":51,"flags":["formulas_cached_only"]}
["Termination Material Composition:",null,null,"Leadframe (Underplate) Material:"]
["Value","Description",null,"Value","Description"]
["Pure matte tin","100% Sn (matte) - no Ni barrier or annealing (Heat treatment)",null,"Alloy 42","Iron-based leadframe material"]
["Pure matte tin – annealed","100% Sn (matte), annealed is a heat treatment (e.g. 150°C for 1 hour)",null,"Copper","Cu, C194, C151, C7025"]
["Pure matte tin – reflowed","100% Sn (matte), reflowed indicates plating was completely melted after application",null,"Beryllium Copper","Be/Cu"]
["Pure matte tin - Ni barrier","100% Sn (matte), a nickel layer is added between the plating and base metal",null,"Brass","Cu/Zn alloy"]
["Pure matte tin - Ag barrier","100% Sn (matte), a silver layer is added between the plating and base metal",null,"Phosphor Bronze","P-Bronze"]
["Pure matte tin – fused","100% Sn (matte), fusing is a reflow operation in a hot oil bath",null,"Nickel","Ni (Used as barrier layer)"]
["Pure matte tin - reflowed over Nickel barrier","100% Sn (matte), reflowed over a nickel layer",null,"Kovar","Iron/Nickel based material"]
["Pure bright tin","100% Sn (bright) - no Ni barrier or annealing (Heat treatment)",null,"Other - please give details in Comments","To specify on Comment column"]
["Pure bright tin – annealed","100% Sn (bright), annealed is a heat treatment (e.g. 150°C for 1 hour)"]
["Pure bright tin – reflowed","100% Sn (bright), reflowed indicates plating was completely melted after application",null,"RoHS Exemptions:"]
["Pure bright tin - Ni barrier","100% Sn (bright), a nickel layer is added between the plating and base metal",null,"Value","Description"]
["Pure bright tin - Ag barrier","100% Sn (bright), a silver layer is added between the plating and base metal",null,1,"Mercury in compact fluorescent lamps not exceeding 5 mg per lamp"]
["Pure bright tin – fused","100% Sn (bright), fusing is a reflow operation in a hot oil bath",null,"2a","Mercury in straight fluorescent lamps for general purposes not exceeding halophosphate 10mg"]
["Pure bright tin - reflowed over Nickel barrier","100% Sn (bright), reflowed over a nickel layer",null,"2b","Mercury in straight fluorescent lamps for general purposes not exceeding triphosphate with normal lifetime 5 mg"]
["Semi-matte tin","100% Sn, material properties fall in between matte and bright conditions",null,"2c","Mercury in straight fluorescent lamps for general purposes not exceeding triphosphate with long lifetime 8 mg"]
["Nickel/Palladium/Gold","Ni/Pd/Au",null,3,"Mercury in straight fluorescent lamps for special purposes"]
["Nickel/Palladium","Ni/Pd",null,4,"Mercury in other lamps not specifically mentioned in this list"]
["Tin/Silver/Copper","Sn/Ag/Cu",null,5,"Lead in glass of cathode ray tubes, electronic components and fluorescent tubes"]
["Hot Dipped Tin/Silver/Copper","Sn/Ag/Cu applied in a molten tin bath process",null,"6a","Lead as an alloying element in steel containing up to 0.35% lead by weight"]
["Tin/Silver","Sn/Ag",null,"6b","Lead as an alloying element in aluminium containing up to 0.40% lead by weight"]
["Hot Dipped Tin/Silver","Sn/Ag applied in a molten tin bath process",null,"6c","Lead as a copper alloy containing up to 4.0% lead by weight"]
["Tin/Copper","Sn/Cu",null,"7a","Lead in high melting temperature type solders (i.e. lead-based solder alloys containing 85 % by weight or more lead)"]
["Hot Dipped Tin/Copper","Sn/Cu applied in a molten tin bath process",null,"7c","Lead in electronic ceramic parts (e.g. piezoelectronic devices)"]
["Tin/Copper – annealed","Sn/Cu, annealed is a heat treatment (e.g. 150°C for 1 hour)",null,8,"Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations"]
["Tin/Lead","Sn/Pb",null,9,"Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators"]
["Tin/Lead/Silver","Sn/Pb/Ag",null,"9a","DecaBDE in polymeric applications"]
["Nickel/Gold","Ni/Au",null,"9b","Lead in lead-bronze bearing shells and bushes"]
["Tin/Bismuth","Sn/Bi",null,11,"Lead used in compliant pin connector systems"]
["Silver/Palladium","Ag/Pd",null,12,"Lead as a coating material for a thermal conduction module c-ring"]
["Silver/Palladium - Ni barrier","Ag/Pd, a nickel layer is added between the plating and base metal",null,"13a","Lead in optical and filter glass"]
["Silver - Ni barrier","100% Ag, a nickel layer is added between the plating and base metal",null,"13b","Cadmium in optical and filter glass"]
["Gold","100% Au",null,14,"Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight"]
["Gold over Nickel","Au plated over a Ni-barrier layer",null,15,"Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages"]
["Nickel","100% Ni",null,"N/A","Not Applicable"]
["Immersion Silver","Imm. Ag"]
["Immersion Tin","Imm. Sn"]
["Electroplated Silver","100% Ag",null,"Moisture Sensitivity:"]
["OSP","Organic polymer over copper",null,"Value","Description"]
["Hot Dipped Tin","100% Sn applied in a molten tin bath process",null,1]
["Zinc","100% Zn or Zn-alloy",null,2]
["Tin/Zinc","Sn plated over Zn",null,"2a"]
["Aluminum","100% Al",null,3]
["Indium alloy","In bearing alloy",null,4]
["Tin/Copper HASL","Sn/Cu Hot Air Solder Leveled",null,5]
["ENIG","Electroless Nickel Immersion Gold",null,"5a"]
["ENEPIG","Electroless Nickel/Electroless Palladium/Immersion Gold",null,6]
["Other - Please give details in Comments","To  specify on Comment column",null,"ANR","Affected (by moisture exposure), no JEDEC rating"]
[{"$nulls":3},"NMS","Not Moisture Sensitive"]
[{"$nulls":3},"IPC/JEDEC J-STD-020C; go to www.jedec.org"]