{"text_format":"3","workbook":"xls","n_sheets":4,"sheets":["MCD","SCD","Abbreviations","Sheet1"],"not_rendered":{"images":14,"external_links":1,"defined_names":4,"comments":17},"read":"whole","date_system":"1900","formulas":"cached_only"}

{"sheet":"MCD","index":0,"n_rows":22,"n_cols":25,"rows_kept":22,"merged":[[0,0,0,24],[1,0,1,24],[2,17,2,22],[3,8,3,9],[5,4,5,24],[6,19,6,24],[7,0,7,24],[11,5,11,14],[11,24,12,24],[13,21,13,23],[14,21,14,23],[15,21,15,23],[16,21,16,23],[17,21,17,23],[18,21,18,23]],"flags":["formulas_cached_only"]}
["Material Composition Declaration "]
["Supplier or Manufacturing Site Information"]
["Contact Name",null,"Yun Ding","Contact Title",null,"QS  Engineer",null,"Contact Phone",null,"86-21-50802030-8110",{"$nulls":5},"Contact Email/Fax",null,"yun_ding@giantec-semi.com"]
["Company Name",null,"Giantec ","Name of person certifying",null,"Frank zhou","Certifying Title",null,"QRA Director",null,"Certifying Phone",{"$nulls":5},"86-21-50802030",null,"Certifying Email",null,"Frank_Zhou@giantec-semi.com"]
["Part Category",null,"IC","Part Name","EEPROM",null,"Package Family",null,"UDFN",null,"Pin count",{"$nulls":5},5,null,"Part wight (mg)",null,{"v":4.734500040744918,"d":"4.73"}]
["Part Number(s)",null,"UDFN"]
["Alternative Recommended Item",null,null,"NA",null,"Alternative Item Name",null,"NA",null,"Availability Date ",{"$nulls":5},"NA","Alternative Part Comments",null,null,"NA"]
["Manufacturing Process Information"]
["Terminal Plating/Grid Array Material Composition",null,null,2,"Terminal Plating Thickness (um)",null,null,"NA","Terminal Base Alloy",null,"C194",{"$nulls":4},"J-STD-020 Moisture",null,1,"Maximum Reflow Temp. ",null,"260 C"]
["Maximum temp. duration (sec)",null,null,10,"Maximum cycles for Reflow",null,null,3,"Comment"]
[]
[null,null,"                  Homogeneous Material ",null,null,"3rd Party Analytical Testing result (ppm)",{"$nulls":10},"Compliance (Yes/No)",null,null,"                 3rd Party Analytical Testing",{"$nulls":4},"MSDS"]
["Item","Name","Vender","Type","Weight (mg)","Cd ","Pb","Hg","Cr-VI","PBBs","PBDEs","DEHP","BBP","DBP","DIBP","RoHS","JIG Level A","Exempt","Lab. Name","Report No.","Date","1.RoHS","2.Halogen","3.PFOS/PFOA"]
[1,"Leadframe","Shinko","C194_Ag",{"v":2.7367143999999994,"d":"2.74"},"N.D.","N.D.","N.D.","Negative","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","ETR22A04534","2022-11-03"]
[2,"Die attach paste","HENKEL","ATB-F125E",{"v":0.0230801164,"d":"0.02"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","ETR22306733","2022-04-06"]
[3,"Copper Wire","Nippon","Pd/Cu",{"v":0.013185931198975185,"d":"0.01"},"N.D.","N.D.","N.D.","Negative","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","ETR23101251","2023-01-16"]
[4,"Molding compound","SUMITOMO","G700",{"v":1.6492736237859429,"d":"1.65"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","SHAEC2210846307","2022-08-03"]
[5,"Platiing Material","Tinking","Pure Tin",{"v":0.060462881360000005,"d":"0.06"},"N.D.",53,"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","SHAEC22002018506","2022-10-12"]
[6,"DIE","SMIC","Silicon",{"v":0.251783088,"d":"0.25"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","CTI","A2220522292101005","2023-01-05"]
[]
[null,"Giantec fill in"]
[null,"Supplier or Manufacturing Site fill in",{"$nulls":15},"Final Compliance Judgement of RoHS",{"$nulls":3},"Yes",null,null,"No"]

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["Substance Composition Declaration "]
["Supplier or Manufacturing Site Information"]
["Response Date",null,"Yun Ding","Contact Name",null,"QS  Engineer","Contact Title",null,0,null,"Contact Phone",null,0,null,"Contact Email/Fax",null,0]
["Company Name",null,"Giantec ","Name of person certifying",null,"Frank zhou","Certifying Title",null,"QRA Director",null,"Certifying Phone",null,"86-21-50802030",null,"Certifying Email",null,"Frank_Zhou@giantec-semi.com"]
["Part Category",null,"IC","Part Name","EEPROM",null,"Package Family",null,"UDFN",null,"Pin count",null,5,null,"Part wight (mg)",null,{"v":4.734500040744918,"d":"4.73"}]
["Part Number(s)",null,"UDFN"]
["Alternative Recommended Item",null,null,"NA",null,"Alternative Item Name",null,"NA",null,"Availability Date ",null,"NA","Alternative Part Comments",null,null,"NA"]
["Manufacturing Process Information"]
["Terminal Plating/Grid Array Material Composition",null,null,2,"Terminal Plating Thickness (um)",null,null,"NA","Terminal Base Alloy",null,"C194","J-STD-020 Moisture",null,1,"Maximum Reflow Temp. ",null,"260 C"]
["Maximum temp. duration (sec)",null,null,10,"Maximum cycles for Reflow",null,null,3,"Comment"]
[]
[null,null,"                  Homogeneous Material ",null,null,"JIG",null,null,"                   Substance",{"$nulls":3},"物质重量J/E%","均质重量\n百分比"]
["Item","Name","Vender","Type","Weight (mg)","Level","Category","Name","CAS","Weight (mg)","PPM","Exempt"]
["UDFN","Leadframe","Shinko","C194_Ag",{"v":2.7367143999999994,"d":"2.737"},"Other",null,"Copper(Cu)","7440-50-8 ",2.6568023395199996,{"v":561157.9505028335,"d":"561,158 "},"No",{"v":0.9646,"d":"96.46%"},{"v":0.5611579505028335,"d":"56.12%"}]
[{"$nulls":5},"Other",null,"Iron(Fe)","7439-89-6",0.05966037391999999,{"v":12601.19831166231,"d":"12,601 "},"No",{"v":0.0228,"d":"2.28%"},{"v":0.01260119831166231,"d":"1.26%"}]
[{"$nulls":5},"Other",null,"Phosphorus(P)","7723-14-0",0.0008210143199999997,{"v":173.41098594030697,"d":"173 "},"No",{"v":0.0003,"d":"0.03%"},{"v":0.00017341098594030697,"d":"0.02%"}]
[{"$nulls":5},"Other",null,"Zinc(Zn)","7440-66-6",0.0038314001599999994,{"v":809.2512677214328,"d":"809 "},"No",{"v":0.0015,"d":"0.15%"},{"v":0.0008092512677214328,"d":"0.08%"}]
[{"$nulls":5},"Other",null,"Silver(Ag)","7440-22-4",0.015599272079999997,{"v":3294.8087328658335,"d":"3,295 "},"No",{"v":0.0108,"d":"1.08%"},{"v":0.0032948087328658333,"d":"0.33%"}]
[null,"Die attach paste","HENKEL","ATB-F125E",{"v":0.023080116400000003,"d":"0.023"},"Other",null,"Silicon dioxide","7631-86-9",0.01384806984,{"v":2924.9275997093814,"d":"2,925 "},"No","30%~60%",{"v":0.0029249275997093815,"d":"0.29%"}]
[{"$nulls":5},"Other",null,"Epxxy Resin","Proprietary",0.00461602328,{"v":974.9758665697939,"d":"975 "},"No","10~30%",{"v":0.0009749758665697939,"d":"0.10%"}]
[{"$nulls":5},"Other",null,"poly[oxy[2-oxiranyl)-1,2-cyclohexanediyl]],a-hydro-w-hydroxy,ether with 2-ethyl-2-(hydroxymethyl)-1,3-propanediol(3:1)","244772-00-7",0.00173100873,{"v":365.6159499636727,"d":"366 "},"No","5%~10%",{"v":0.0003656159499636727,"d":"0.04%"}]
[{"$nulls":5},"Other",null,"Phenol-formaldehyde ploymer","9003-35-4",0.00173100873,{"v":365.6159499636727,"d":"366 "},"No","5%~10%",{"v":0.0003656159499636727,"d":"0.04%"}]
[{"$nulls":5},"Other",null,"Reaction Product","25068-38-6",0.00115400582,{"v":243.74396664244847,"d":"244 "},"No","1%~5%",{"v":0.00024374396664244847,"d":"0.02%"}]
[null,"Copper Wire","Nippon","Pd/Cu",{"v":0.013185931198975185,"d":"0.013"},"Other",null,"Copper(Cu)","7440-50-8 ",0.012829911056602855,{"v":2709.876638755762,"d":"2,710 "},"No","> 97.28",{"v":0.002709876638755762,"d":"0.27%"}]
[{"$nulls":5},"Other",null,"Palladium(Pd)","7440-05-3",0.00035602014237233,{"v":75.19698792025238,"d":"75 "},"No","≦ 2.7",{"v":7.519698792025239e-05,"d":"0.01%"}]
[null,"Molding compound","SUMITOMO","G700",{"v":1.6492736237859429,"d":"1.649"},"Other",null,"Epoxy Resin","Trade Secret",0.11544915366501601,{"v":24384.655754877018,"d":"24,385 "},"No","5– 10%",{"v":0.024384655754877017,"d":"2.44%"}]
[{"$nulls":5},"Other",null,"Silica(Amorphous) A","60676-86-0",1.3606507396234029,{"v":287390.5856824791,"d":"287,391 "},"No","70 - 90%",{"v":0.2873905856824791,"d":"28.74%"}]
[{"$nulls":5},"Other",null,"Silica(Amorphous) B","7631-86-9",0.11544915366501601,{"v":24384.655754877018,"d":"24,385 "},"No","5– 10%",{"v":0.024384655754877017,"d":"2.44%"}]
[{"$nulls":5},"Other",null,"Phenol Resin","Trade Secret",0.04947820871357828,{"v":10450.566752090146,"d":"10,451 "},"No","1– 5%",{"v":0.010450566752090147,"d":"1.05%"}]
[{"$nulls":5},"Other",null,"Carbon Black","1333-86-4",0.008246368118929714,{"v":1741.7611253483578,"d":"1,742 "},"No","0.1 - 1%",{"v":0.0017417611253483579,"d":"0.17%"}]
[null,"Pure tin(Sn)","Tinking","Pure Tin",{"v":0.060462881360000005,"d":"0.060"},"Other",null,"Pure tin(Sn)","7440-31-5",0.060462881360000005,{"v":12770.700356882222,"d":"12,771 "},"No","≥99.99 %",{"v":0.012770700356882221,"d":"1.28%"}]
[null,"DIE","SMIC","Silicon",{"v":0.251783088,"d":"0.252"},"Other",null,"Silicon ","7440-21-3",0.251783088,{"v":53180.50181289784,"d":"53,181 "},"No",{"v":1,"d":"100.00%"},{"v":0.053180501812897844,"d":"5.32%"}]
[]
[null," Giantec fill in"]
[null,"Supplier or Manufacturing Site fill in"]

{"sheet":"Abbreviations","index":2,"n_rows":51,"n_cols":5,"rows_kept":51,"flags":["formulas_cached_only"]}
["Termination Material Composition:",null,null,"Leadframe (Underplate) Material:"]
["Value","Description",null,"Value","Description"]
["Pure matte tin","100% Sn (matte) - no Ni barrier or annealing (Heat treatment)",null,"Alloy 42","Iron-based leadframe material"]
["Pure matte tin – annealed","100% Sn (matte), annealed is a heat treatment (e.g. 150°C for 1 hour)",null,"Copper","Cu, C194, C151, C7025"]
["Pure matte tin – reflowed","100% Sn (matte), reflowed indicates plating was completely melted after application",null,"Beryllium Copper","Be/Cu"]
["Pure matte tin - Ni barrier","100% Sn (matte), a nickel layer is added between the plating and base metal",null,"Brass","Cu/Zn alloy"]
["Pure matte tin - Ag barrier","100% Sn (matte), a silver layer is added between the plating and base metal",null,"Phosphor Bronze","P-Bronze"]
["Pure matte tin – fused","100% Sn (matte), fusing is a reflow operation in a hot oil bath",null,"Nickel","Ni (Used as barrier layer)"]
["Pure matte tin - reflowed over Nickel barrier","100% Sn (matte), reflowed over a nickel layer",null,"Kovar","Iron/Nickel based material"]
["Pure bright tin","100% Sn (bright) - no Ni barrier or annealing (Heat treatment)",null,"Other - please give details in Comments","To specify on Comment column"]
["Pure bright tin – annealed","100% Sn (bright), annealed is a heat treatment (e.g. 150°C for 1 hour)"]
["Pure bright tin – reflowed","100% Sn (bright), reflowed indicates plating was completely melted after application",null,"RoHS Exemptions:"]
["Pure bright tin - Ni barrier","100% Sn (bright), a nickel layer is added between the plating and base metal",null,"Value","Description"]
["Pure bright tin - Ag barrier","100% Sn (bright), a silver layer is added between the plating and base metal",null,1,"Mercury in compact fluorescent lamps not exceeding 5 mg per lamp"]
["Pure bright tin – fused","100% Sn (bright), fusing is a reflow operation in a hot oil bath",null,"2a","Mercury in straight fluorescent lamps for general purposes not exceeding halophosphate 10mg"]
["Pure bright tin - reflowed over Nickel barrier","100% Sn (bright), reflowed over a nickel layer",null,"2b","Mercury in straight fluorescent lamps for general purposes not exceeding triphosphate with normal lifetime 5 mg"]
["Semi-matte tin","100% Sn, material properties fall in between matte and bright conditions",null,"2c","Mercury in straight fluorescent lamps for general purposes not exceeding triphosphate with long lifetime 8 mg"]
["Nickel/Palladium/Gold","Ni/Pd/Au",null,3,"Mercury in straight fluorescent lamps for special purposes"]
["Nickel/Palladium","Ni/Pd",null,4,"Mercury in other lamps not specifically mentioned in this list"]
["Tin/Silver/Copper","Sn/Ag/Cu",null,5,"Lead in glass of cathode ray tubes, electronic components and fluorescent tubes"]
["Hot Dipped Tin/Silver/Copper","Sn/Ag/Cu applied in a molten tin bath process",null,"6a","Lead as an alloying element in steel containing up to 0.35% lead by weight"]
["Tin/Silver","Sn/Ag",null,"6b","Lead as an alloying element in aluminium containing up to 0.40% lead by weight"]
["Hot Dipped Tin/Silver","Sn/Ag applied in a molten tin bath process",null,"6c","Lead as a copper alloy containing up to 4.0% lead by weight"]
["Tin/Copper","Sn/Cu",null,"7a","Lead in high melting temperature type solders (i.e. lead-based solder alloys containing 85 % by weight or more lead)"]
["Hot Dipped Tin/Copper","Sn/Cu applied in a molten tin bath process",null,"7c","Lead in electronic ceramic parts (e.g. piezoelectronic devices)"]
["Tin/Copper – annealed","Sn/Cu, annealed is a heat treatment (e.g. 150°C for 1 hour)",null,8,"Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations"]
["Tin/Lead","Sn/Pb",null,9,"Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators"]
["Tin/Lead/Silver","Sn/Pb/Ag",null,"9a","DecaBDE in polymeric applications"]
["Nickel/Gold","Ni/Au",null,"9b","Lead in lead-bronze bearing shells and bushes"]
["Tin/Bismuth","Sn/Bi",null,11,"Lead used in compliant pin connector systems"]
["Silver/Palladium","Ag/Pd",null,12,"Lead as a coating material for a thermal conduction module c-ring"]
["Silver/Palladium - Ni barrier","Ag/Pd, a nickel layer is added between the plating and base metal",null,"13a","Lead in optical and filter glass"]
["Silver - Ni barrier","100% Ag, a nickel layer is added between the plating and base metal",null,"13b","Cadmium in optical and filter glass"]
["Gold","100% Au",null,14,"Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight"]
["Gold over Nickel","Au plated over a Ni-barrier layer",null,15,"Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages"]
["Nickel","100% Ni",null,"N/A","Not Applicable"]
["Immersion Silver","Imm. Ag"]
["Immersion Tin","Imm. Sn"]
["Electroplated Silver","100% Ag",null,"Moisture Sensitivity:"]
["OSP","Organic polymer over copper",null,"Value","Description"]
["Hot Dipped Tin","100% Sn applied in a molten tin bath process",null,1]
["Zinc","100% Zn or Zn-alloy",null,2]
["Tin/Zinc","Sn plated over Zn",null,"2a"]
["Aluminum","100% Al",null,3]
["Indium alloy","In bearing alloy",null,4]
["Tin/Copper HASL","Sn/Cu Hot Air Solder Leveled",null,5]
["ENIG","Electroless Nickel Immersion Gold",null,"5a"]
["ENEPIG","Electroless Nickel/Electroless Palladium/Immersion Gold",null,6]
["Other - Please give details in Comments","To  specify on Comment column",null,"ANR","Affected (by moisture exposure), no JEDEC rating"]
[{"$nulls":3},"NMS","Not Moisture Sensitive"]
[{"$nulls":3},"IPC/JEDEC J-STD-020C; go to www.jedec.org"]

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