{"text_format":"3","workbook":"xls","n_sheets":4,"sheets":["MCD","SCD","Abbreviations","Sheet1"],"not_rendered":{"images":14,"external_links":1,"defined_names":5,"comments":17},"read":"whole","date_system":"1900","formulas":"cached_only"}

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["Material Composition Declaration "]
["Supplier or Manufacturing Site Information"]
["Contact Name",null,"Angela Le","Contact Title",null,"QS/DCC Engineer",null,"Contact Phone",null,"86-21-50802030-8105",{"$nulls":5},"Contact Email/Fax",null,"angela_le@giantec-semi.com"]
["Company Name",null,"Giantec ","Name of person certifying",null,"Frank zhou","Certifying Title",null,"QRA Director",null,"Certifying Phone",{"$nulls":5},"86-21-50802030",null,"Certifying Email",null,"Frank_Zhou@giantec-semi.com"]
["Part Category",null,"IC","Part Name","EEPROM",null,"Package Family",null,"UDFN",null,"Pin count",{"$nulls":5},8,null,"Part wight (mg)",null,{"v":12.082713757205758,"d":"12.08"}]
["Part Number(s)",null,"UDFN"]
["Alternative Recommended Item",null,null,"NA",null,"Alternative Item Name",null,"NA",null,"Availability Date ",{"$nulls":5},"NA","Alternative Part Comments",null,null,"NA"]
["Manufacturing Process Information"]
["Terminal Plating/Grid Array Material Composition",null,null,2,"Terminal Plating Thickness (um)",null,null,"NA","Terminal Base Alloy",null,"C194",{"$nulls":4},"J-STD-020 Moisture",null,1,"Maximum Reflow Temp. ",null,"260 C"]
["Maximum temp. duration (sec)",null,null,10,"Maximum cycles for Reflow",null,null,3,"Comment"]
[]
[null,null,"                  Homogeneous Material ",null,null,"3rd Party Analytical Testing result (ppm)",{"$nulls":10},"Compliance (Yes/No)",null,null,"                 3rd Party Analytical Testing",{"$nulls":4},"MSDS"]
["Item","Name","Vender","Type","Weight (mg)","Cd ","Pb","Hg","Cr-VI","PBBs","PBDEs","DEHP","BBP","DBP","DIBP","RoHS","JIG Level A","Exempt","Lab. Name","Report No.","Date","1.RoHS","2.Halogen","3.PFOS/PFOA"]
[1,"Leadframe","Shinko","CDA194+Ag",{"v":6.89928,"d":"6.899"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","ETR22A04534","2022-11-03"]
[2,"Die attach paste","SHOWA DENKO","EN4900G*",{"v":0.189137036,"d":"0.189"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","ETR22701026M17","2022-07-12"]
[3,"Copper Wire","Nippon","Cu",{"v":0.01816043851776,"d":"0.018"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","ETR23101251","2023-01-16"]
[4,"Molding compound","SUMITOMO","EME-G700",{"v":4.128403850688,"d":"4.128"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","SHAEC2210846307","2022-08-03"]
[5,"Plating Material","Tinking","Pure Tin",{"v":0.179732432,"d":"0.180"},"N.D.",53,"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","SHAEC22002018506","2022-10-12"]
[6,"DIE","SMIC","Silicon ",0.668,"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","CTI","A2220522292101005","2023-01-05"]
[]
[null,"Giantec fill in"]
[null,"Supplier or Manufacturing Site fill in",{"$nulls":15},"Final Compliance Judgement of RoHS",{"$nulls":3},"Yes",null,null,"No"]

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["Substance Composition Declaration "]
["Supplier or Manufacturing Site Information"]
["Response Date",null,"Angela Le","Contact Name",null,"QS/DCC Engineer","Contact Title",null,0,null,"Contact Phone",null,0,null,"Contact Email/Fax",null,0]
["Company Name",null,"Giantec ","Name of person certifying",null,"Frank zhou","Certifying Title",null,"QRA Director",null,"Certifying Phone",null,"86-21-50802030",null,"Certifying Email",null,"Frank_Zhou@giantec-semi.com"]
["Part Category",null,"IC","Part Name","EEPROM",null,"Package Family",null,"UDFN",null,"Pin count",null,8,null,"Part wight (mg)",null,{"v":12.08271375720576,"d":"12.08"}]
["Part Number(s)",null,"UDFN"]
["Alternative Recommended Item",null,null,"NA",null,"Alternative Item Name",null,"NA",null,"Availability Date ",null,"NA","Alternative Part Comments",null,null,"NA"]
["Manufacturing Process Information"]
["Terminal Plating/Grid Array Material Composition",null,null,2,"Terminal Plating Thickness (um)",null,null,"NA","Terminal Base Alloy",null,"C194","J-STD-020 Moisture",null,1,"Maximum Reflow Temp. ",null,"260 C"]
["Maximum temp. duration (sec)",null,null,10,"Maximum cycles for Reflow",null,null,3,"Comment"]
[]
[null,null,"                  Homogeneous Material ",null,null,"JIG",null,null,"                   Substance",{"$nulls":3},"物质重量J/E%","均质重量\n百分比"]
["Item","Name","Vender","Type","Weight (mg)","Level","Category","Name","CAS","Weight (mg)","PPM","Exempt"]
["UDFN","Leadframe","Shinko","CDA194+Ag",{"v":6.89928,"d":"6.899"},"Other",null,"Copper(Cu)","7440-50-8 ",{"v":6.697821024,"d":"6.6978"},{"v":554330.8530342056,"d":"554,331 "},"No",{"v":0.9646,"d":"96.46%"},{"v":0.5543308530342056,"d":"55.43%"}]
[{"$nulls":5},"Other",null,"Iron(Fe)","7439-89-6",{"v":0.150404304,"d":"0.1504"},{"v":12447.891013747098,"d":"12,448 "},"No",{"v":0.0228,"d":"2.28%"},{"v":0.012447891013747098,"d":"1.24%"}]
[{"$nulls":5},"Other",null,"Phosphorus(P)","7723-14-0",{"v":0.0020697839999999994,"d":"0.0021"},{"v":171.3012524827582,"d":"171 "},"No",{"v":0.0003,"d":"0.03%"},{"v":0.0001713012524827582,"d":"0.02%"}]
[{"$nulls":5},"Other",null,"Zinc(Zn)","7440-66-6",{"v":0.009658992,"d":"0.0097"},{"v":799.4058449195385,"d":"799 "},"No",{"v":0.0015,"d":"0.15%"},{"v":0.0007994058449195385,"d":"0.08%"}]
[{"$nulls":5},"Other",null,"Silver(Ag)","7440-22-4",{"v":0.039325896,"d":"0.0393"},{"v":3254.723797172406,"d":"3,255 "},"No",{"v":0.0108,"d":"1.08%"},{"v":0.0032547237971724064,"d":"0.33%"}]
[null,"Die attach paste","SHOWA DENKO","EN4900G*",{"v":0.18913703599999998,"d":"0.189"},"Other",null,"Silver"," 7440-22-4",{"v":0.13996140664,"d":"0.1400"},{"v":11583.60691583307,"d":"11,584 "},"No",{"v":0.7400000000000001,"d":"74.00%"},{"v":0.01158360691583307,"d":"1.16%"}]
[{"$nulls":5},"Other",null,"Acrylic resin","Trade secret",{"v":0.01702233324,"d":"0.0170"},{"v":1408.8170573310492,"d":"1,409 "},"No",{"v":0.09000000000000001,"d":"9.00%"},{"v":0.0014088170573310491,"d":"0.14%"}]
[{"$nulls":5},"Other",null,"Polybutadiene derivative ","Trade secret",{"v":0.0094568518,"d":"0.0095"},{"v":782.676142961694,"d":"783 "},"No",{"v":0.05000000000000001,"d":"5.00%"},{"v":0.0007826761429616941,"d":"0.08%"}]
[{"$nulls":5},"Other",null,"Butadiene copolymer","Trade secret",{"v":0.0028370555400000002,"d":"0.0028"},{"v":234.8028428885082,"d":"235 "},"No",{"v":0.015000000000000003,"d":"1.50%"},{"v":0.0002348028428885082,"d":"0.02%"}]
[{"$nulls":5},"Other",null,"Acrylate ","Trade secret",{"v":0.011348222160000001,"d":"0.0113"},{"v":939.2113715540328,"d":"939 "},"No",{"v":0.06000000000000001,"d":"6.00%"},{"v":0.0009392113715540328,"d":"0.09%"}]
[{"$nulls":5},"Other",null,"Epoxy resin","Trade secret",{"v":0.0047284259,"d":"0.0047"},{"v":391.338071480847,"d":"391 "},"No",{"v":0.025000000000000005,"d":"2.50%"},{"v":0.00039133807148084704,"d":"0.04%"}]
[{"$nulls":5},"Other",null,"Peroxide","Trade secret",{"v":0.0009456851800000001,"d":"0.0009"},{"v":78.26761429616941,"d":"78 "},"No",{"v":0.005000000000000001,"d":"0.50%"},{"v":7.826761429616941e-05,"d":"0.01%"}]
[{"$nulls":5},"Other",null,"Additive","Trade secret",{"v":0.0028370555400000002,"d":"0.0028"},{"v":234.8028428885082,"d":"235 "},"No",{"v":0.015000000000000003,"d":"1.50%"},{"v":0.0002348028428885082,"d":"0.02%"}]
[null,"Copper Wire","Nippon","Cu",{"v":0.018160438517760006,"d":"0.018"},"Other",null,"Copper(Cu)","7440-50-8 ",{"v":0.017670106677780486,"d":"0.0177"},{"v":1462.4286425094344,"d":"1,462 "},"No",{"v":0.973,"d":"97.30%"},{"v":0.0014624286425094345,"d":"0.15%"}]
[{"$nulls":5},"Other",null,"Palladium(Pd)","7440-05-3",{"v":0.0004903318399795202,"d":"0.0005"},{"v":40.581267572204254,"d":"41 "},"No",{"v":0.027,"d":"2.70%"},{"v":4.058126757220425e-05,"d":"0.00%"}]
[null,"Molding compound","SUMITOMO","G700",{"v":4.1284038506880005,"d":"4.128"},"Other",null,"Epoxy Resin","Trade Secret",{"v":0.28898826954816004,"d":"0.2890"},{"v":23917.4969593082,"d":"23,917 "},"No",{"v":0.07,"d":"7.00%"},{"v":0.0239174969593082,"d":"2.39%"}]
[{"$nulls":5},"Other",null,"Silica(Amorphous) A","60676-86-0",{"v":3.4059331768176,"d":"3.4059"},{"v":281884.7855918466,"d":"281,885 "},"No",{"v":0.825,"d":"82.50%"},{"v":0.2818847855918466,"d":"28.19%"}]
[{"$nulls":5},"Other",null,"Silica(Amorphous) B","7631-86-9",{"v":0.28898826954816004,"d":"0.2890"},{"v":23917.4969593082,"d":"23,917 "},"No",{"v":0.07,"d":"7.00%"},{"v":0.0239174969593082,"d":"2.39%"}]
[{"$nulls":5},"Other",null,"Phenol Resin","Trade Secret",{"v":0.12385211552064002,"d":"0.1239"},{"v":10250.355839703512,"d":"10,250 "},"No",{"v":0.03,"d":"3.00%"},{"v":0.010250355839703513,"d":"1.03%"}]
[{"$nulls":5},"Other",null,"Carbon Black","1333-86-4",{"v":0.020642019253440003,"d":"0.0206"},{"v":1708.3926399505856,"d":"1,708 "},"No",{"v":0.005,"d":"0.50%"},{"v":0.0017083926399505856,"d":"0.17%"}]
[null,"Plating Material","Tinking","Pure Tin",{"v":0.179732432,"d":"0.180"},"Other",null,"Pure tin(Sn)","7440-31-5",{"v":0.179732432,"d":"0.1797"},{"v":14875.17089385761,"d":"14,875 "},"No",{"v":1,"d":"100.00%"},{"v":0.01487517089385761,"d":"1.49%"}]
[null,"DIE","SMIC","Silicon ",0.668,"Other",null,"Silicon ","7440-21-3",{"v":0.666607888,"d":"0.6666"},{"v":55170.37822752821,"d":"55,170 "},"No",{"v":0.997916,"d":"99.79%"},{"v":0.055170378227528204,"d":"5.52%"}]
[{"$nulls":5},"Other",null,"Other","Trade Secret",{"v":0.0013921119999999831,"d":"0.0014"},{"v":115.21517665431497,"d":"115 "},"No",{"v":0.0020839999999999748,"d":"0.21%"},{"v":0.00011521517665431497,"d":"0.01%"}]
[]
[null," Giantec fill in"]
[null,"Supplier or Manufacturing Site fill in"]

{"sheet":"Abbreviations","index":2,"n_rows":51,"n_cols":5,"rows_kept":51,"flags":["formulas_cached_only"]}
["Termination Material Composition:",null,null,"Leadframe (Underplate) Material:"]
["Value","Description",null,"Value","Description"]
["Pure matte tin","100% Sn (matte) - no Ni barrier or annealing (Heat treatment)",null,"Alloy 42","Iron-based leadframe material"]
["Pure matte tin – annealed","100% Sn (matte), annealed is a heat treatment (e.g. 150°C for 1 hour)",null,"Copper","Cu, C194, C151, C7025"]
["Pure matte tin – reflowed","100% Sn (matte), reflowed indicates plating was completely melted after application",null,"Beryllium Copper","Be/Cu"]
["Pure matte tin - Ni barrier","100% Sn (matte), a nickel layer is added between the plating and base metal",null,"Brass","Cu/Zn alloy"]
["Pure matte tin - Ag barrier","100% Sn (matte), a silver layer is added between the plating and base metal",null,"Phosphor Bronze","P-Bronze"]
["Pure matte tin – fused","100% Sn (matte), fusing is a reflow operation in a hot oil bath",null,"Nickel","Ni (Used as barrier layer)"]
["Pure matte tin - reflowed over Nickel barrier","100% Sn (matte), reflowed over a nickel layer",null,"Kovar","Iron/Nickel based material"]
["Pure bright tin","100% Sn (bright) - no Ni barrier or annealing (Heat treatment)",null,"Other - please give details in Comments","To specify on Comment column"]
["Pure bright tin – annealed","100% Sn (bright), annealed is a heat treatment (e.g. 150°C for 1 hour)"]
["Pure bright tin – reflowed","100% Sn (bright), reflowed indicates plating was completely melted after application",null,"RoHS Exemptions:"]
["Pure bright tin - Ni barrier","100% Sn (bright), a nickel layer is added between the plating and base metal",null,"Value","Description"]
["Pure bright tin - Ag barrier","100% Sn (bright), a silver layer is added between the plating and base metal",null,1,"Mercury in compact fluorescent lamps not exceeding 5 mg per lamp"]
["Pure bright tin – fused","100% Sn (bright), fusing is a reflow operation in a hot oil bath",null,"2a","Mercury in straight fluorescent lamps for general purposes not exceeding halophosphate 10mg"]
["Pure bright tin - reflowed over Nickel barrier","100% Sn (bright), reflowed over a nickel layer",null,"2b","Mercury in straight fluorescent lamps for general purposes not exceeding triphosphate with normal lifetime 5 mg"]
["Semi-matte tin","100% Sn, material properties fall in between matte and bright conditions",null,"2c","Mercury in straight fluorescent lamps for general purposes not exceeding triphosphate with long lifetime 8 mg"]
["Nickel/Palladium/Gold","Ni/Pd/Au",null,3,"Mercury in straight fluorescent lamps for special purposes"]
["Nickel/Palladium","Ni/Pd",null,4,"Mercury in other lamps not specifically mentioned in this list"]
["Tin/Silver/Copper","Sn/Ag/Cu",null,5,"Lead in glass of cathode ray tubes, electronic components and fluorescent tubes"]
["Hot Dipped Tin/Silver/Copper","Sn/Ag/Cu applied in a molten tin bath process",null,"6a","Lead as an alloying element in steel containing up to 0.35% lead by weight"]
["Tin/Silver","Sn/Ag",null,"6b","Lead as an alloying element in aluminium containing up to 0.40% lead by weight"]
["Hot Dipped Tin/Silver","Sn/Ag applied in a molten tin bath process",null,"6c","Lead as a copper alloy containing up to 4.0% lead by weight"]
["Tin/Copper","Sn/Cu",null,"7a","Lead in high melting temperature type solders (i.e. lead-based solder alloys containing 85 % by weight or more lead)"]
["Hot Dipped Tin/Copper","Sn/Cu applied in a molten tin bath process",null,"7c","Lead in electronic ceramic parts (e.g. piezoelectronic devices)"]
["Tin/Copper – annealed","Sn/Cu, annealed is a heat treatment (e.g. 150°C for 1 hour)",null,8,"Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations"]
["Tin/Lead","Sn/Pb",null,9,"Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators"]
["Tin/Lead/Silver","Sn/Pb/Ag",null,"9a","DecaBDE in polymeric applications"]
["Nickel/Gold","Ni/Au",null,"9b","Lead in lead-bronze bearing shells and bushes"]
["Tin/Bismuth","Sn/Bi",null,11,"Lead used in compliant pin connector systems"]
["Silver/Palladium","Ag/Pd",null,12,"Lead as a coating material for a thermal conduction module c-ring"]
["Silver/Palladium - Ni barrier","Ag/Pd, a nickel layer is added between the plating and base metal",null,"13a","Lead in optical and filter glass"]
["Silver - Ni barrier","100% Ag, a nickel layer is added between the plating and base metal",null,"13b","Cadmium in optical and filter glass"]
["Gold","100% Au",null,14,"Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight"]
["Gold over Nickel","Au plated over a Ni-barrier layer",null,15,"Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages"]
["Nickel","100% Ni",null,"N/A","Not Applicable"]
["Immersion Silver","Imm. Ag"]
["Immersion Tin","Imm. Sn"]
["Electroplated Silver","100% Ag",null,"Moisture Sensitivity:"]
["OSP","Organic polymer over copper",null,"Value","Description"]
["Hot Dipped Tin","100% Sn applied in a molten tin bath process",null,1]
["Zinc","100% Zn or Zn-alloy",null,2]
["Tin/Zinc","Sn plated over Zn",null,"2a"]
["Aluminum","100% Al",null,3]
["Indium alloy","In bearing alloy",null,4]
["Tin/Copper HASL","Sn/Cu Hot Air Solder Leveled",null,5]
["ENIG","Electroless Nickel Immersion Gold",null,"5a"]
["ENEPIG","Electroless Nickel/Electroless Palladium/Immersion Gold",null,6]
["Other - Please give details in Comments","To  specify on Comment column",null,"ANR","Affected (by moisture exposure), no JEDEC rating"]
[{"$nulls":3},"NMS","Not Moisture Sensitive"]
[{"$nulls":3},"IPC/JEDEC J-STD-020C; go to www.jedec.org"]

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