{"text_format":"3","workbook":"xls","n_sheets":3,"sheets":["MCD","SCD","Abbreviations"],"not_rendered":{"images":15,"external_links":1,"defined_names":4,"comments":17},"read":"whole","date_system":"1900","formulas":"cached_only"}

{"sheet":"MCD","index":0,"n_rows":22,"n_cols":25,"rows_kept":22,"merged":[[0,0,0,24],[1,0,1,24],[2,17,2,22],[3,8,3,9],[4,16,4,17],[5,7,5,24],[6,19,6,24],[7,0,7,24],[11,5,11,14],[11,18,11,23],[11,24,12,24],[13,21,13,23],[14,21,14,23],[15,21,15,23],[16,21,16,23],[17,21,17,23],[18,21,18,23]],"flags":["formulas_cached_only"]}
["Material Composition Declaration "]
["Supplier or Manufacturing Site Information"]
["Contact Name",null,"Yun Ding","Contact Title",null,"QS Engineer",null,"Contact Phone",null,"86-21-50802030",{"$nulls":5},"Contact Email/Fax",null,"yun_ding@giantec-semi.com"]
["Company Name",null,"Giantec ","Name of person certifying",null,"Frank zhou","Certifying Title",null,"QRA Director",null,"Certifying Phone",{"$nulls":5},"86-21-50802030",null,"Certifying Email",null,"Frank_Zhou@giantec-semi.com"]
["Part Category",null,"IC","Part Name","EEPROM",null,"Package Family",null,"TSSOP",null,"Pin count",{"$nulls":5},8,null,"Part wight (mg)",null,{"v":42.52856507666331,"d":"42.53"}]
["Part Number(s)",null,"GT24CXX-XZLX, GT25CXX-XZLX, GT34CXX-XZLX，GT93CXX-XZLX,"]
["Alternative Recommended Item",null,null,"NA",null,"Alternative Item Name",null,"NA",null,"Availability Date ",{"$nulls":5},"NA","Alternative Part Comments",null,null,"NA"]
["Manufacturing Process Information"]
["Terminal Plating/Grid Array Material Composition",null,null,2,"Terminal Plating Thickness (um)",null,null,"7.5~17","Terminal Base Alloy",null,"C194",{"$nulls":4},"J-STD-020 Moisture",null,1,"Maximum Reflow Temp. ",null,"260 C"]
["Maximum temp. duration (sec)",null,null,10,"Maximum cycles for Reflow",null,null,3,"Comment"]
[]
[null,null,"                  Homogeneous Material ",null,null,"3rd Party Analytical Testing result (ppm)",{"$nulls":10},"Compliance (Yes/No)",null,"                 3rd Party Analytical Testing",{"$nulls":5},"MSDS"]
["Item","Name","Vender","Type","Weight (mg)","Cd ","Pb","Hg","Cr-VI","PBBs","PBDEs","DEHP","BBP","DBP","DIBP","RoHS","JIG Level A","Exempt","Lab. Name","Report No.","Date","1.RoHS","2.Halogen","3.PFOS/PFOA"]
[1,"Leadframe","SAMSUNG\n(HAESUNGDS)","C7025-Ag",{"v":17.86608,"d":"17.87"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","ETR22900581","2022-09-13"]
[2,"Die attach paste","SHOWA DENKO","EN4900G*",{"v":0.057360312,"d":"0.06"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","ETR22701026M17","2022-07-12"]
[3,"Gold Wire","HERAEUS","HA3",{"v":0.1106126366633165,"d":"0.11"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","CANEC2209323001","2022-05-25"]
[4,"Molding compound","SD","CEL-9240HF",{"v":23.9382,"d":"23.94"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","SHAEC22003258323\nSHAEC22003258324","2022-11-23"]
[5,"Lead finish \n(Matte Sn) on leadframe","Tinking","Sn 99.99%",{"v":0.273312128,"d":"0.27"},"N.D.",53,"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","SHAEC22002018506","2022-10-12"]
[6,"DIE","SMIC","Silicon",{"v":0.283,"d":"0.28"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","CTI","A2220522292101005","2023-01-05"]
[]
[null,"Giantec fill in"]
[null,"Supplier or Manufacturing Site fill in",{"$nulls":15},"Final Compliance Judgement of GP",{"$nulls":3},"Yes",null,null,"No"]

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["Substance Composition Declaration "]
["Supplier or Manufacturing Site Information"]
["Response Date",null,"NA","Contact Name",null,"Yun Ding","Contact Title",null,"QS Engineer",null,"Contact Phone",null,"86-21-50802030",null,"Contact Email/Fax",null,"yun_ding@giantec-semi.com"]
["Company Name",null,"Giantec ","Name of person certifying",null,"Frank zhou","Certifying Title",null,"QRA Director",null,"Certifying Phone",null,"86-21-50802030",null,"Certifying Email",null,"Frank_Zhou@giantec-semi.com"]
["Part Category",null,"IC","Part Name","EEPROM",null,"Package Family",null,"TSSOP",null,"Pin count",null,8,null,"Part wight (mg)",null,42.53]
["Part Number(s)",null,"GT24CXX-XZLX, GT25CXX-XZLX, GT34CXX-XZLX，GT93CXX-XZLX,"]
["Alternative Recommended Item",null,null,"NA",null,"Alternative Item Name",null,"NA",null,"Availability Date ",null,"NA","Alternative Part Comments",null,null,"NA"]
["Manufacturing Process Information"]
["Terminal Plating/Grid Array Material Composition",null,null,2,"Terminal Plating Thickness (um)",null,null,"7.5~17","Terminal Base Alloy",null,"C194","J-STD-020 Moisture",null,1,"Maximum Reflow Temp. ",null,"260 C"]
["Maximum temp. duration (sec)",null,null,10,"Maximum cycles for Reflow",null,null,3,"Comment",null,0]
[]
[null,null,"                  Homogeneous Material ",null,null,"JIG",null,null,"                   Substance",{"$nulls":3},"物质重量J/E%","均质重量\n百分比"]
["Item","Name","Vender","Type","Weight (mg)","Level","Category","Name","CAS","Weight (mg)","PPM","Exempt"]
["TSSOP","Leadframe","SAMSUNG","C7025-Ag",{"v":17.86608,"d":"17.87"},"Other",null,"Cu","7440-50-8 ",17.04424032,{"v":400771.5823300298,"d":"400,772 "},"No",{"v":0.954,"d":"95.40%"},{"v":0.4007715823300298,"d":"40.08%"}]
[{"$nulls":3},"C7025-Ag",null,"Other",null,"Ni","7440-02-0",0.57171456,{"v":13443.071943984227,"d":"13,443 "},"No",{"v":0.032,"d":"3.20%"},{"v":0.013443071943984227,"d":"1.34%"}]
[{"$nulls":3},"C7025-Ag",null,"Other",null,"Si","7440-21-3",0.12952908000000002,{"v":3045.695987308927,"d":"3,046 "},"No",{"v":0.00725,"d":"0.73%"},{"v":0.003045695987308927,"d":"0.30%"}]
[{"$nulls":3},"C7025-Ag",null,"Other",null,"Mg","7439-95-4",0.031265640000000004,{"v":735.1679969366376,"d":"735 "},"No",{"v":0.00175,"d":"0.18%"},{"v":0.0007351679969366375,"d":"0.07%"}]
[{"$nulls":3},"C7025-Ag",null,"Other",null,"Ag","7440-22-4",0.0893304,{"v":2100.4799912475355,"d":"2,100 "},"No",{"v":0.005,"d":"0.50%"},{"v":0.0021004799912475356,"d":"0.21%"}]
[null,"Die attach paste","SHOWA DENKO","EN4900G*",{"v":0.057360312,"d":"0.06"},"Other",null,"Silver"," 7440-22-4",0.042446630879999996,{"v":998.0734314333057,"d":"998 "},"No",{"v":0.74,"d":"74.00%"},{"v":0.0009980734314333057,"d":"0.10%"}]
[{"$nulls":3},"EN4900G*",null,"Other",null,"Acrylic resin","Trade secret",0.00516242808,{"v":121.38730922837502,"d":"121 "},"No",{"v":0.09,"d":"9.00%"},{"v":0.00012138730922837501,"d":"0.01%"}]
[{"$nulls":3},"EN4900G*",null,"Other",null,"Polybutadiene derivative ","Trade secret",0.0028680156,{"v":67.4373940157639,"d":"67 "},"No",{"v":0.05,"d":"5.00%"},{"v":6.74373940157639e-05,"d":"0.01%"}]
[{"$nulls":3},"EN4900G*",null,"Other",null,"Butadiene copolymer","Trade secret",0.0008604046799999999,{"v":20.231218204729167,"d":"20 "},"No",{"v":0.015,"d":"1.50%"},{"v":2.0231218204729167e-05,"d":"0.00%"}]
[{"$nulls":3},"EN4900G*",null,"Other",null,"Acrylate ","Trade secret",0.0034416187199999997,{"v":80.92487281891667,"d":"81 "},"No",{"v":0.06,"d":"6.00%"},{"v":8.092487281891667e-05,"d":"0.01%"}]
[{"$nulls":3},"EN4900G*",null,"Other",null,"Epoxy resin","Trade secret",0.0014340078,{"v":33.71869700788195,"d":"34 "},"No",{"v":0.025,"d":"2.50%"},{"v":3.371869700788195e-05,"d":"0.00%"}]
[{"$nulls":3},"EN4900G*",null,"Other",null,"Peroxide","Trade secret",0.00028680156,{"v":6.74373940157639,"d":"7 "},"No",{"v":0.005,"d":"0.50%"},{"v":6.743739401576389e-06,"d":"0.00%"}]
[{"$nulls":3},"EN4900G*",null,"Other",null,"Additive","Trade secret",0.0008604046799999999,{"v":20.231218204729167,"d":"20 "},"No",{"v":0.015,"d":"1.50%"},{"v":2.0231218204729167e-05,"d":"0.00%"}]
[null,"Gold Wire","HERAEUS","HA3 ",{"v":0.1106126366633165,"d":"0.11"},"Other",null,"Au","7440-57-5",0.109495449033017,{"v":2574.6330457102677,"d":"2,575 "},"No",{"v":0.9899,"d":"99%"},{"v":0.002574633045710268,"d":"0.26%"}]
[{"$nulls":5},"Other",null,"Palladium(Pd)",2023568,0.001106126366633165,{"v":26.009021575010287,"d":"26 "},"No",{"v":0.01,"d":"1.00%"},{"v":2.6009021575010287e-05,"d":"0.00%"}]
[{"$nulls":5},"Other",null,"other","Trade secret",1.106126366633165e-05,{"v":0.2585169188463661,"d":"0.3"},"No",{"v":0.0001,"d":"0.01%"},{"v":2.5851691884636607e-07,"d":"0.00%"}]
[null,"Molding compound","SD","CEL-9240HF",{"v":23.9382,"d":"23.94"},"Other",null,"Epoxy resin1","Trade secret",0.598455,{"v":14071.836162852105,"d":"14,072 "},"No",{"v":0.025,"d":"2.50%"},{"v":0.014071836162852106,"d":"1.41%"}]
[{"$nulls":5},"Other",null,"Epoxy resin2","Trade secret",0.359073,{"v":8443.101697711263,"d":"8,443 "},"No",{"v":0.015,"d":"1.50%"},{"v":0.008443101697711263,"d":"0.84%"}]
[{"$nulls":5},"Other",null,"Hardener","Trade secret",0.837837,{"v":19700.57062799295,"d":"19,701 "},"No",{"v":0.035,"d":"3.50%"},{"v":0.01970057062799295,"d":"1.97%"}]
[{"$nulls":5},"Other",null,"Catalyst","Trade secret",0.01340402,{"v":281,"d":"281 "},"No",{"v":0.0005,"d":"0.05%"},{"v":0.0003,"d":"0.03%"}]
[{"$nulls":5},"Other",null,"Carbon black","1333-86-4",0.0478764,{"v":1125.7468930281684,"d":"1,126 "},"No",{"v":0.002,"d":"0.20%"},{"v":0.0011257468930281685,"d":"0.11%"}]
[{"$nulls":5},"Other",null,"Amorphous silica1","60676-86-0",19.15056,{"v":450298.75721126737,"d":"450,299 "},"No",{"v":0.8,"d":"80.00%"},{"v":0.4502987572112674,"d":"45.03%"}]
[{"$nulls":5},"Other",null,"Amorphous silica2","7631-86-7",2.9324294999999996,{"v":68951.99719797532,"d":"68,952 "},"No",{"v":0.1225,"d":"12.25%"},{"v":0.06895199719797532,"d":"6.90%"}]
[null,"Lead finish \n(Matte Sn) on leadframe","Tinking","Sn 99.99%",{"v":0.273312128,"d":"0.27"},"Other",null,"Sn","7440-31-5",0.273312128,{"v":6426.554187928022,"d":"6,427 "},"No",{"v":1,"d":"100.00%"},{"v":0.006426554187928021,"d":"0.64%"}]
[null,"DIE","SMIC","Silicon",{"v":0.283,"d":"0.28"},"Other",null,"Silicon ","7440-21-3",0.282410228,{"v":6640.483343158146,"d":"6,640 "},"No",{"v":0.997916,"d":"99.79%"},{"v":0.006640483343158147,"d":"0.66%"}]
[null,null,"SMIC","Si/Al",null,"Other",null,"Others","Trade Secret",0.0005897719999999928,{"v":13.86766750622438,"d":"14 "},"No",{"v":0.0020839999999999748,"d":"0.21%"},{"v":1.386766750622438e-05,"d":"0.00%"}]
[]
[null," Giantec fill in"]
[null,"Supplier or Manufacturing Site fill in"]

{"sheet":"Abbreviations","index":2,"n_rows":51,"n_cols":5,"rows_kept":51,"flags":["formulas_cached_only"]}
["Termination Material Composition:",null,null,"Leadframe (Underplate) Material:"]
["Value","Description",null,"Value","Description"]
["Pure matte tin","100% Sn (matte) - no Ni barrier or annealing (Heat treatment)",null,"Alloy 42","Iron-based leadframe material"]
["Pure matte tin – annealed","100% Sn (matte), annealed is a heat treatment (e.g. 150°C for 1 hour)",null,"Copper","Cu, C194, C151, C7025"]
["Pure matte tin – reflowed","100% Sn (matte), reflowed indicates plating was completely melted after application",null,"Beryllium Copper","Be/Cu"]
["Pure matte tin - Ni barrier","100% Sn (matte), a nickel layer is added between the plating and base metal",null,"Brass","Cu/Zn alloy"]
["Pure matte tin - Ag barrier","100% Sn (matte), a silver layer is added between the plating and base metal",null,"Phosphor Bronze","P-Bronze"]
["Pure matte tin – fused","100% Sn (matte), fusing is a reflow operation in a hot oil bath",null,"Nickel","Ni (Used as barrier layer)"]
["Pure matte tin - reflowed over Nickel barrier","100% Sn (matte), reflowed over a nickel layer",null,"Kovar","Iron/Nickel based material"]
["Pure bright tin","100% Sn (bright) - no Ni barrier or annealing (Heat treatment)",null,"Other - please give details in Comments","To specify on Comment column"]
["Pure bright tin – annealed","100% Sn (bright), annealed is a heat treatment (e.g. 150°C for 1 hour)"]
["Pure bright tin – reflowed","100% Sn (bright), reflowed indicates plating was completely melted after application",null,"RoHS Exemptions:"]
["Pure bright tin - Ni barrier","100% Sn (bright), a nickel layer is added between the plating and base metal",null,"Value","Description"]
["Pure bright tin - Ag barrier","100% Sn (bright), a silver layer is added between the plating and base metal",null,1,"Mercury in compact fluorescent lamps not exceeding 5 mg per lamp"]
["Pure bright tin – fused","100% Sn (bright), fusing is a reflow operation in a hot oil bath",null,"2a","Mercury in straight fluorescent lamps for general purposes not exceeding halophosphate 10mg"]
["Pure bright tin - reflowed over Nickel barrier","100% Sn (bright), reflowed over a nickel layer",null,"2b","Mercury in straight fluorescent lamps for general purposes not exceeding triphosphate with normal lifetime 5 mg"]
["Semi-matte tin","100% Sn, material properties fall in between matte and bright conditions",null,"2c","Mercury in straight fluorescent lamps for general purposes not exceeding triphosphate with long lifetime 8 mg"]
["Nickel/Palladium/Gold","Ni/Pd/Au",null,3,"Mercury in straight fluorescent lamps for special purposes"]
["Nickel/Palladium","Ni/Pd",null,4,"Mercury in other lamps not specifically mentioned in this list"]
["Tin/Silver/Copper","Sn/Ag/Cu",null,5,"Lead in glass of cathode ray tubes, electronic components and fluorescent tubes"]
["Hot Dipped Tin/Silver/Copper","Sn/Ag/Cu applied in a molten tin bath process",null,"6a","Lead as an alloying element in steel containing up to 0.35% lead by weight"]
["Tin/Silver","Sn/Ag",null,"6b","Lead as an alloying element in aluminium containing up to 0.40% lead by weight"]
["Hot Dipped Tin/Silver","Sn/Ag applied in a molten tin bath process",null,"6c","Lead as a copper alloy containing up to 4.0% lead by weight"]
["Tin/Copper","Sn/Cu",null,"7a","Lead in high melting temperature type solders (i.e. lead-based solder alloys containing 85 % by weight or more lead)"]
["Hot Dipped Tin/Copper","Sn/Cu applied in a molten tin bath process",null,"7c","Lead in electronic ceramic parts (e.g. piezoelectronic devices)"]
["Tin/Copper – annealed","Sn/Cu, annealed is a heat treatment (e.g. 150°C for 1 hour)",null,8,"Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations"]
["Tin/Lead","Sn/Pb",null,9,"Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators"]
["Tin/Lead/Silver","Sn/Pb/Ag",null,"9a","DecaBDE in polymeric applications"]
["Nickel/Gold","Ni/Au",null,"9b","Lead in lead-bronze bearing shells and bushes"]
["Tin/Bismuth","Sn/Bi",null,11,"Lead used in compliant pin connector systems"]
["Silver/Palladium","Ag/Pd",null,12,"Lead as a coating material for a thermal conduction module c-ring"]
["Silver/Palladium - Ni barrier","Ag/Pd, a nickel layer is added between the plating and base metal",null,"13a","Lead in optical and filter glass"]
["Silver - Ni barrier","100% Ag, a nickel layer is added between the plating and base metal",null,"13b","Cadmium in optical and filter glass"]
["Gold","100% Au",null,14,"Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight"]
["Gold over Nickel","Au plated over a Ni-barrier layer",null,15,"Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages"]
["Nickel","100% Ni",null,"N/A","Not Applicable"]
["Immersion Silver","Imm. Ag"]
["Immersion Tin","Imm. Sn"]
["Electroplated Silver","100% Ag",null,"Moisture Sensitivity:"]
["OSP","Organic polymer over copper",null,"Value","Description"]
["Hot Dipped Tin","100% Sn applied in a molten tin bath process",null,1]
["Zinc","100% Zn or Zn-alloy",null,2]
["Tin/Zinc","Sn plated over Zn",null,"2a"]
["Aluminum","100% Al",null,3]
["Indium alloy","In bearing alloy",null,4]
["Tin/Copper HASL","Sn/Cu Hot Air Solder Leveled",null,5]
["ENIG","Electroless Nickel Immersion Gold",null,"5a"]
["ENEPIG","Electroless Nickel/Electroless Palladium/Immersion Gold",null,6]
["Other - Please give details in Comments","To  specify on Comment column",null,"ANR","Affected (by moisture exposure), no JEDEC rating"]
[{"$nulls":3},"NMS","Not Moisture Sensitive"]
[{"$nulls":3},"IPC/JEDEC J-STD-020C; go to www.jedec.org"]