{"text_format":"3","workbook":"xls","n_sheets":3,"sheets":["MCD","SCD","Abbreviations"],"not_rendered":{"images":18,"external_links":1,"defined_names":4,"comments":17},"read":"whole","date_system":"1900","formulas":"cached_only"}

{"sheet":"MCD","index":0,"n_rows":22,"n_cols":25,"rows_kept":22,"merged":[[0,0,0,24],[1,0,1,24],[3,8,3,9],[4,16,4,17],[5,7,5,24],[6,19,6,24],[7,0,7,24],[11,5,11,14],[11,18,11,23],[11,24,12,24],[13,21,13,23],[14,21,14,23],[15,21,15,23],[16,21,16,23],[17,21,17,23],[18,21,18,23]],"flags":["formulas_cached_only"]}
["Material Composition Declaration "]
["Supplier or Manufacturing Site Information"]
["Response Date",null,"Aug/13/2015","Contact Name",null,"Angela Le","Contact Title",null,"QS Section Manager",null,"Contact Phone",{"$nulls":5},"86-21-50802030",null,"Contact Email/Fax",null,"angela_le@giantec-semi.com"]
["Company Name",null,"Giantec ","Name of person certifying",null,"Frank zhou","Certifying Title",null,"QRA Director",null,"Certifying Phone",{"$nulls":5},"86-21-50802030",null,"Certifying Email",null,"Frank_Zhou@giantec-semi.com"]
["Part Category",null,"IC","Part Name","EEPROM",null,"Package Family",null,"SOP",null,"Pin count",{"$nulls":5},8,null,"Part wight (mg)",null,{"v":72,"d":"72.00"}]
["Part Number(s)",null,"GT24CXX"]
["Alternative Recommended Item",null,null,"NA",null,"Alternative Item Name",null,"NA",null,"Availability Date ",{"$nulls":5},"NA","Alternative Part Comments",null,null,"NA"]
["Manufacturing Process Information"]
["Terminal Plating/Grid Array Material Composition",null,null,2,"Terminal Plating Thickness (um)",null,null,"7.5~17","Terminal Base Alloy",null,"A194",{"$nulls":4},"J-STD-020 Moisture",null,1,"Maximum Reflow Temp. ",null,"260 C"]
["Maximum temp. duration (sec)",null,null,10,"Maximum cycles for Reflow",null,null,3,"Comment"]
[]
[null,null,"                  Homogeneous Material ",null,null,"3rd Party Analytical Testing result (ppm)",{"$nulls":10},"Compliance (Yes/No)",null,"                 3rd Party Analytical Testing",{"$nulls":5},"MSDS"]
["Item","Name","Vender","Type","Weight (mg)","Cd ","Pb","Hg","Cr-VI","PBBs","PBDEs","DEHP","BBP","DBP","DIBP","RoHS","JIG Level A","Exempt","Lab. Name","Report No.","Date","1.RoHS","2.Halogen","3.PFOS/PFOA"]
[1,"Leadframe","AAM","Ag+A194",{"v":21.3,"d":"21.30"},"N.D.",18.8,"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","EKR22801838\nEKR22801843","2022-09-06"]
[2,"Die attach paste","Henkel","8200T",{"v":1,"d":"1.00"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","SHAEC2207860406\nSHAEC2207860408\nSHAEC2207860407","2022-06-28"]
[3,"Copper Wire","MKE","Cu/Pd",{"v":0.7,"d":"0.70"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","SHAEC2208861607","2022-05-17"]
[4,"Molding compound","SD","CEL-9220HF",{"v":46,"d":"46.00"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","SHAEC22003258315\nSHAEC22003258316","2022-11-23"]
[5,"Lead finish \n(Matte Sn) on leadframe","HTBJ\n","Sn",{"v":2,"d":"2.00"},"N.D.",16,"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","TSNEC2201040501","2022-05-11"]
[6,"DIE","SMIC","silicon",{"v":1,"d":"1.00"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","CTI","A2220522292101005","2023-01-05"]
[]
[null,"Giantec fill in"]
[null,"Supplier or Manufacturing Site fill in",{"$nulls":15},"Final Compliance Judgement of RoHS",{"$nulls":3},"Yes",null,null,"No"]

{"sheet":"SCD","index":1,"n_rows":38,"n_cols":17,"rows_kept":38,"merged":[[0,0,0,18],[1,0,1,18],[4,12,4,13],[5,7,5,18],[6,15,6,18],[7,0,7,18],[11,12,12,12],[11,13,12,13],[11,19,12,19],[13,0,34,0],[13,1,18,1],[13,2,18,2],[13,3,18,3],[13,4,18,4],[19,1,21,1],[19,2,21,2],[19,3,21,3],[19,4,21,4],[22,1,23,1],[22,2,23,2],[22,3,23,3],[22,4,23,4],[24,1,30,1],[24,2,30,2],[24,3,30,3],[24,4,30,4],[31,1,32,1],[31,2,32,2],[31,3,32,3],[31,4,32,4],[33,1,34,1],[33,2,34,2],[33,3,34,3],[33,4,34,4]],"flags":["formulas_cached_only"]}
["Substance Composition Declaration "]
["Supplier or Manufacturing Site Information"]
["Response Date",null,"Aug/13/2015","Contact Name",null,"Angela Le","Contact Title",null,"QS Section Manager",null,"Contact Phone",null,"86-21-50802030",null,"Contact Email/Fax",null,"angela_le@giantec-semi.com"]
["Company Name",null,"Giantec ","Name of person certifying",null,"Frank zhou","Certifying Title",null,"QRA Director",null,"Certifying Phone",null,"86-21-50802030",null,"Certifying Email",null,"Frank_Zhou@giantec-semi.com"]
["Part Category",null,"IC","Part Name","EEPROM",null,"Package Family",null,"SOP",null,"Pin count",null,8,null,"Part wight (mg)",null,{"v":72,"d":"72.00"}]
["Part Number(s)",null,"GT24CXX"]
["Alternative Recommended Item",null,null,"NA",null,"Alternative Item Name",null,"NA",null,"Availability Date ",null,"NA","Alternative Part Comments",null,null,"NA"]
["Manufacturing Process Information"]
["Terminal Plating/Grid Array Material Composition",null,null,2,"Terminal Plating Thickness (um)",null,null,"7.5~17","Terminal Base Alloy",null,"A194","J-STD-020 Moisture",null,1,"Maximum Reflow Temp. ",null,"260 C"]
["Maximum temp. duration (sec)",null,null,10,"Maximum cycles for Reflow",null,null,3,"Comment",null,0]
[]
[null,null,"                  Homogeneous Material ",null,null,"JIG",null,null,"                   Substance",{"$nulls":3},"均质物质重量J/E%","物质占总重量\n百分比"]
["Item","Name","Vender","Type","Weight (mg)","Level","Category","Name","CAS","Weight (mg)","PPM","Exempt"]
["SOP","Leadframe","AAM","A194",21.3,"/",null,"Cu","7440-50-8 ",19.573635000000003,{"v":271856.0416666667,"d":"271,856 "},"No",{"v":0.91895,"d":"91.895%"},{"v":0.2718560416666667,"d":"27.1856%"}]
[{"$nulls":5},"/",null,"Fe","7439-89-6",0.5325000000000001,{"v":7395.833333333334,"d":"7,396 "},"No",{"v":0.025,"d":"2.500%"},{"v":0.007395833333333334,"d":"0.7396%"}]
[{"$nulls":5},"/",null,"Pb","7439-92-1",0.0010650000000000002,{"v":14.79166666666667,"d":"15 "},"No",{"v":5e-05,"d":"0.005%"},{"v":1.479166666666667e-05,"d":"0.0015%"}]
[{"$nulls":5},"/",null,"P","7723-14-0",0.0213,{"v":295.8333333333333,"d":"296 "},"No",{"v":0.001,"d":"0.100%"},{"v":0.00029583333333333333,"d":"0.0296%"}]
[{"$nulls":5},"/",null,"Zn","7440-66-6",0.21300000000000002,{"v":2958.3333333333335,"d":"2,958 "},"No",{"v":0.01,"d":"1.000%"},{"v":0.0029583333333333336,"d":"0.2958%"}]
[{"$nulls":5},"/",null,"Ag","7440-22-4",0.9585,{"v":13312.5,"d":"13,313 "},"No",{"v":0.045,"d":"4.500%"},{"v":0.0133125,"d":"1.3313%"}]
[null,"Die attach paste","Henkel","8200T",{"v":1,"d":"1.000"},"/",null,"Arcylate","Proprietary",0.25,{"v":3472.222222222222,"d":"3,472 "},"No",{"v":0.25,"d":"25.00%"},{"v":0.003472222222222222,"d":"0.3472%"}]
[{"$nulls":5},"/",null,"Curing agent & hardener","Proprietary",0.07,{"v":972.2222222222223,"d":"972 "},"No",{"v":0.07,"d":"7.00%"},{"v":0.0009722222222222223,"d":"0.0972%"}]
[{"$nulls":5},"/",null,"Silver powder","7440-22-4",0.68,{"v":9444.444444444445,"d":"9,444 "},"No",{"v":0.68,"d":"68.00%"},{"v":0.009444444444444445,"d":"0.9444%"}]
[null,"Copper Wire","MKE","Cu/Pd",{"v":0.7,"d":"0.700"},"/",null,"Cu","7440-50-8 ",0.6789999999999999,{"v":9430.555555555555,"d":"9,431 "},"No",{"v":0.97,"d":"97%"},{"v":0.009430555555555555,"d":"0.9431%"}]
[{"$nulls":5},"/",null,"other","/",0.020999999999999998,{"v":291.66666666666663,"d":"292 "},"No",{"v":0.03,"d":"3%"},{"v":0.00029166666666666664,"d":"0.0292%"}]
[null,"Molding compound","SD","CEL-9220HF10TS(LS)",{"v":46,"d":"46.000"},"/",null,"Epoxy Resin 1","Trade secret",1.1500000000000001,{"v":15972.222222222224,"d":"15,972 "},"No",{"v":0.025,"d":"2.50%"},{"v":0.015972222222222224,"d":"1.5972%"}]
[{"$nulls":5},"/",null,"Epoxy Resin 2","Trade secret",1.1500000000000001,{"v":15972.222222222224,"d":"15,972 "},"No",{"v":0.025,"d":"2.50%"},{"v":0.015972222222222224,"d":"1.5972%"}]
[{"$nulls":5},"/",null,"Epoxy Resin 3","Trade secret",1.1500000000000001,{"v":15972.222222222224,"d":"15,972 "},"No",{"v":0.025,"d":"2.50%"},{"v":0.015972222222222224,"d":"1.5972%"}]
[{"$nulls":5},"/",null,"Hardener","Trade secret",1.38,{"v":19166.666666666664,"d":"19,167 "},"No",{"v":0.03,"d":"3.00%"},{"v":0.019166666666666665,"d":"1.9167%"}]
[{"$nulls":5},"/",null,"Carbon black","1333-86-4",0.046,{"v":638.8888888888889,"d":"639 "},"No",{"v":0.001,"d":"0.10%"},{"v":0.0006388888888888889,"d":"0.0639%"}]
[{"$nulls":7},"Amorphous silica","60676-86-0",40.204,{"v":558388.888888889,"d":"558,389 "},"No",{"v":0.874,"d":"87.40%"},{"v":0.5583888888888889,"d":"55.8389%"}]
[{"$nulls":5},"/",null,"Crystal silica","14808-60-7",0.92,{"v":12777.77777777778,"d":"12,778 "},"No",{"v":0.02,"d":"2.00%"},{"v":0.012777777777777779,"d":"1.2778%"}]
[null,"Lead finish \n(Matte Sn) on leadframe","HTBJ\n","Sn",{"v":2,"d":"2.000"},"/",null,"Sn","7440-31-5",1.9998,{"v":27775,"d":"27,775 "},"No",{"v":0.9999,"d":"99.99%"},{"v":0.027775,"d":"2.7775%"}]
[{"$nulls":5},"/",null,"other ","/",0.0002,{"v":2.777777777777778,"d":"3 "},"No",{"v":0.0001,"d":"0.01%"},{"v":2.777777777777778e-06,"d":"0.0003%"}]
[null,"DIE","SMIC","silicon",{"v":1,"d":"1.000"},"/",null,"Silicon ","7440-21-3",0.997916,{"v":13859.944444444445,"d":"13,860 "},"No",{"v":0.997916,"d":"99.79%"},{"v":0.013859944444444446,"d":"1.3860%"}]
[{"$nulls":3},"Si/Al",null,"/",null,"other","/",0.0020839999999999748,{"v":28.944444444444095,"d":"29 "},"No",{"v":0.0020839999999999748,"d":"0.21%"},{"v":2.8944444444444094e-05,"d":"0.0029%"}]
[]
[null," Giantec fill in"]
[null,"Supplier or Manufacturing Site fill in"]

{"sheet":"Abbreviations","index":2,"n_rows":51,"n_cols":5,"rows_kept":51,"flags":["formulas_cached_only"]}
["Termination Material Composition:",null,null,"Leadframe (Underplate) Material:"]
["Value","Description",null,"Value","Description"]
["Pure matte tin","100% Sn (matte) - no Ni barrier or annealing (Heat treatment)",null,"Alloy 42","Iron-based leadframe material"]
["Pure matte tin – annealed","100% Sn (matte), annealed is a heat treatment (e.g. 150°C for 1 hour)",null,"Copper","Cu, C194, C151, C7025"]
["Pure matte tin – reflowed","100% Sn (matte), reflowed indicates plating was completely melted after application",null,"Beryllium Copper","Be/Cu"]
["Pure matte tin - Ni barrier","100% Sn (matte), a nickel layer is added between the plating and base metal",null,"Brass","Cu/Zn alloy"]
["Pure matte tin - Ag barrier","100% Sn (matte), a silver layer is added between the plating and base metal",null,"Phosphor Bronze","P-Bronze"]
["Pure matte tin – fused","100% Sn (matte), fusing is a reflow operation in a hot oil bath",null,"Nickel","Ni (Used as barrier layer)"]
["Pure matte tin - reflowed over Nickel barrier","100% Sn (matte), reflowed over a nickel layer",null,"Kovar","Iron/Nickel based material"]
["Pure bright tin","100% Sn (bright) - no Ni barrier or annealing (Heat treatment)",null,"Other - please give details in Comments","To specify on Comment column"]
["Pure bright tin – annealed","100% Sn (bright), annealed is a heat treatment (e.g. 150°C for 1 hour)"]
["Pure bright tin – reflowed","100% Sn (bright), reflowed indicates plating was completely melted after application",null,"RoHS Exemptions:"]
["Pure bright tin - Ni barrier","100% Sn (bright), a nickel layer is added between the plating and base metal",null,"Value","Description"]
["Pure bright tin - Ag barrier","100% Sn (bright), a silver layer is added between the plating and base metal",null,1,"Mercury in compact fluorescent lamps not exceeding 5 mg per lamp"]
["Pure bright tin – fused","100% Sn (bright), fusing is a reflow operation in a hot oil bath",null,"2a","Mercury in straight fluorescent lamps for general purposes not exceeding halophosphate 10mg"]
["Pure bright tin - reflowed over Nickel barrier","100% Sn (bright), reflowed over a nickel layer",null,"2b","Mercury in straight fluorescent lamps for general purposes not exceeding triphosphate with normal lifetime 5 mg"]
["Semi-matte tin","100% Sn, material properties fall in between matte and bright conditions",null,"2c","Mercury in straight fluorescent lamps for general purposes not exceeding triphosphate with long lifetime 8 mg"]
["Nickel/Palladium/Gold","Ni/Pd/Au",null,3,"Mercury in straight fluorescent lamps for special purposes"]
["Nickel/Palladium","Ni/Pd",null,4,"Mercury in other lamps not specifically mentioned in this list"]
["Tin/Silver/Copper","Sn/Ag/Cu",null,5,"Lead in glass of cathode ray tubes, electronic components and fluorescent tubes"]
["Hot Dipped Tin/Silver/Copper","Sn/Ag/Cu applied in a molten tin bath process",null,"6a","Lead as an alloying element in steel containing up to 0.35% lead by weight"]
["Tin/Silver","Sn/Ag",null,"6b","Lead as an alloying element in aluminium containing up to 0.40% lead by weight"]
["Hot Dipped Tin/Silver","Sn/Ag applied in a molten tin bath process",null,"6c","Lead as a copper alloy containing up to 4.0% lead by weight"]
["Tin/Copper","Sn/Cu",null,"7a","Lead in high melting temperature type solders (i.e. lead-based solder alloys containing 85 % by weight or more lead)"]
["Hot Dipped Tin/Copper","Sn/Cu applied in a molten tin bath process",null,"7c","Lead in electronic ceramic parts (e.g. piezoelectronic devices)"]
["Tin/Copper – annealed","Sn/Cu, annealed is a heat treatment (e.g. 150°C for 1 hour)",null,8,"Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations"]
["Tin/Lead","Sn/Pb",null,9,"Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators"]
["Tin/Lead/Silver","Sn/Pb/Ag",null,"9a","DecaBDE in polymeric applications"]
["Nickel/Gold","Ni/Au",null,"9b","Lead in lead-bronze bearing shells and bushes"]
["Tin/Bismuth","Sn/Bi",null,11,"Lead used in compliant pin connector systems"]
["Silver/Palladium","Ag/Pd",null,12,"Lead as a coating material for a thermal conduction module c-ring"]
["Silver/Palladium - Ni barrier","Ag/Pd, a nickel layer is added between the plating and base metal",null,"13a","Lead in optical and filter glass"]
["Silver - Ni barrier","100% Ag, a nickel layer is added between the plating and base metal",null,"13b","Cadmium in optical and filter glass"]
["Gold","100% Au",null,14,"Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight"]
["Gold over Nickel","Au plated over a Ni-barrier layer",null,15,"Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages"]
["Nickel","100% Ni",null,"N/A","Not Applicable"]
["Immersion Silver","Imm. Ag"]
["Immersion Tin","Imm. Sn"]
["Electroplated Silver","100% Ag",null,"Moisture Sensitivity:"]
["OSP","Organic polymer over copper",null,"Value","Description"]
["Hot Dipped Tin","100% Sn applied in a molten tin bath process",null,1]
["Zinc","100% Zn or Zn-alloy",null,2]
["Tin/Zinc","Sn plated over Zn",null,"2a"]
["Aluminum","100% Al",null,3]
["Indium alloy","In bearing alloy",null,4]
["Tin/Copper HASL","Sn/Cu Hot Air Solder Leveled",null,5]
["ENIG","Electroless Nickel Immersion Gold",null,"5a"]
["ENEPIG","Electroless Nickel/Electroless Palladium/Immersion Gold",null,6]
["Other - Please give details in Comments","To  specify on Comment column",null,"ANR","Affected (by moisture exposure), no JEDEC rating"]
[{"$nulls":3},"NMS","Not Moisture Sensitive"]
[{"$nulls":3},"IPC/JEDEC J-STD-020C; go to www.jedec.org"]