{"text_format":"3","workbook":"xls","n_sheets":3,"sheets":["MCD","SCD","Abbreviations"],"not_rendered":{"images":17,"external_links":2,"defined_names":5,"comments":19},"read":"whole","date_system":"1900","formulas":"cached_only"}

{"sheet":"MCD","index":0,"n_rows":52,"n_cols":21,"rows_kept":52,"merged":[[0,0,0,20],[1,0,1,20],[2,13,2,18],[3,8,3,9],[4,16,4,20],[5,15,5,20],[6,16,6,20],[7,0,7,20],[7,21,7,41],[7,42,7,62],[7,63,7,83],[7,84,7,104],[7,105,7,125],[7,126,7,146],[7,147,7,167],[7,168,7,188],[7,189,7,209],[7,210,7,230],[7,231,7,251],[7,252,7,255],[11,5,11,10],[11,20,12,20],[13,17,13,19],[14,17,14,19],[15,17,15,19],[16,17,16,19],[17,17,17,19],[18,17,18,19]],"flags":["formulas_cached_only"]}
["Material Composition Declaration "]
["Supplier or Manufacturing Site Information"]
["Contact Name",null,"Angela Le","Contact Title",null,"QS/DCC Engineer",null,"Contact Phone",null,"86-21-50802030-8105",null,"Contact Email/Fax",null,"angela_le@giantec-semi.com"]
["Company Name",null,"Giantec ","Name of person certifying",null,"Frank zhou","Certifying Title",null,"QRA Director",null,"Certifying Phone",null,"86-21-50802030",null,"Certifying Email",null,"Frank_Zhou@giantec-semi.com"]
["Part Category",null,"IC","Part Name","OPA",null,"Package Family",null,"MSOP",null,"Pin count",null,8,null,"Part weight (mg)",null,{"v":32.723301450680765,"d":"32.72"}]
["Part Number(s)",null,"GTV358-SGI-TR"]
["Alternative Recommended Item",null,null,"NA",null,"Alternative Item Name",null,"NA",null,"Availability Date ",null,"NA","Alternative Part Comments",null,null,"NA"]
["Manufacturing Process Information"]
["Terminal Plating/Grid Array Material Composition",null,null,2,"Terminal Plating Thickness (um)",null,null,"7.5~17","Terminal Base Alloy",null,"C194","J-STD-020 Moisture",null,3,"Maximum Reflow Temp. ",null,"260 C"]
["Maximum temp. duration (sec)",null,null,10,"Maximum cycles for Reflow",null,null,3,"Comment"]
[]
[null,null,"                  Homogeneous Material ",null,null,"3rd Party Analytical Testing result (ppm)",{"$nulls":6},"Compliance (Yes/No)",null,null,"                 3rd Party Analytical Testing",{"$nulls":4},"MSDS"]
["Item","Name","Vender","Type","Weight (mg)","Cd ","Pb","Hg","Cr-VI","PBBs","PBDEs","RoHS","JIG Level A","Exempt","Lab. Name","Report No.","Date","1.RoHS","2.Halogen","3.PFOS/PFOA"]
[1,"Leadframe","DCI","C7025",{"v":13.297578839999998,"d":"13.30"},"N.D.",22.1,"N.D.","Negative","N.D.","N.D.","Yes","Yes","No","TUV","221411524-02","2017-03-11"]
[2,"Die attach paste","HITACHI","EN4900G",{"v":0.069157088,"d":"0.07"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","CE/2017/85740C","2017-09-05"]
[3,"Gold Wire","HERAEUS","HD",{"v":0.0610677498807721,"d":"0.06"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","SHAEC1815028027","2018-07-24"]
[4,"Molding compound","HITACHI","CEL-9240HF",{"v":18.626399999999997,"d":"18.63"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","1.CE/2019/12682\n2.CE/2019/12684","2019-01-18"]
[5,"Lead finish \n(Matte Sn) on leadframe","Tinking","Sn 99.99%",{"v":0.3273803968,"d":"0.33"},"N.D.",14,"N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","SGS","SHAEC1825375207 A01","2018-12-03"]
[6,"DIE","SMIC","Si/Al",{"v":0.341717376,"d":"0.34"},"N.D.","N.D.","N.D.","N.D.","N.D.","N.D.","Yes","Yes","No","CTI","A2180255102101003","2019-01-10"]
[]
[null,"Giantec fill in"]
[null,"Supplier or Manufacturing Site fill in",{"$nulls":11},"Final Compliance Judgement of GP",{"$nulls":3},"Yes",null,null,"No"]
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[]
[{"$nulls":4},0.3273803968]
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[]
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[{"$nulls":4},32.723301450680765]

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["Substance Composition Declaration "]
["Supplier or Manufacturing Site Information"]
["Response Date",null,"Angela Le","Contact Name",null,"QS/DCC Engineer","Contact Title",null,0,null,"Contact Phone",null,0,null,"Contact Email/Fax",null,0]
["Company Name",null,"Giantec ","Name of person certifying",null,"Frank zhou","Certifying Title",null,"QRA Director",null,"Certifying Phone",null,"86-21-50802030",null,"Certifying Email",null,"Frank_Zhou@giantec-semi.com"]
["Part Category",null,"IC","Part Name","OPA",null,"Package Family",null,"MSOP",null,"Pin count",null,8,null,"Part wight (mg)",null,{"v":32.723301450680765,"d":"32.72"}]
["Part Number(s)",null,"GTV358-SGI-TR"]
["Alternative Recommended Item",null,null,"NA",null,"Alternative Item Name",null,"NA",null,"Availability Date ",null,"NA","Alternative Part Comments",null,null,"NA"]
["Manufacturing Process Information"]
["Terminal Plating/Grid Array Material Composition",null,null,2,"Terminal Plating Thickness (um)",null,null,"7.5~17","Terminal Base Alloy",null,"C194","J-STD-020 Moisture",null,3,"Maximum Reflow Temp. ",null,"260 C"]
["Maximum temp. duration (sec)",null,null,10,"Maximum cycles for Reflow",null,null,3,"Comment",null,0]
[]
[null,null,"                  Homogeneous Material ",null,null,"JIG",null,null,"                   Substance",{"$nulls":3},"J/E%","%"]
["Item","Name","Vender","Type","Weight (mg)","Level","Category","Name","CAS","Weight (mg)","PPM","Exempt"]
["MSOP","Leadframe","DCI","C7025",{"v":13.297578839999998,"d":"13.30"},"Other",null,"Copper (Cu)","7440-50-8",12.832163580599998,{"v":392141.47142030013,"d":"392,141 "},"No","90~97%",{"v":0.39214147142030015,"d":"39.214%"}]
[{"$nulls":5},"Other",null,"Others","Trade Secret",0.1329757884,{"v":4063.6421908839397,"d":"4,064 "},"No","<1%",{"v":0.00406364219088394,"d":"0.406%"}]
[{"$nulls":5},"Other",null,"Plated Silver (Ag)","7440-22-4",0.332439471,{"v":10159.10547720985,"d":"10,159 "},"No","0.120-12.480%",{"v":0.01015910547720985,"d":"1.016%"}]
[null,"Die attach paste","HITACHI","EN4900G",{"v":0.069157088,"d":"0.07"},"Other",null,"Silver","7440-22-4",0.05152203056,{"v":1574.4753211301713,"d":"1,574 "},"No","72-82%",{"v":0.0015744753211301714,"d":"0.157%"}]
[{"$nulls":5},"Other",null,"Acrylic resin","Trade Secret",0.005878352480000001,{"v":179.638123887335,"d":"180 "},"No","6-11%",{"v":0.00017963812388733502,"d":"0.018%"}]
[{"$nulls":5},"Other",null,"Polybutadiene derivative","Trade Secret",0.00276628352,{"v":84.53558771168706,"d":"85 "},"No","2-9%",{"v":8.453558771168706e-05,"d":"0.008%"}]
[{"$nulls":5},"Other",null,"Butadiene copolymer","Trade Secret",0.00138314176,{"v":42.26779385584353,"d":"42 "},"No","<2%",{"v":4.226779385584353e-05,"d":"0.004%"}]
[{"$nulls":5},"Other",null,"Epoxy resin","Trade Secret",0.0017289272000000002,{"v":52.83474231980442,"d":"53 "},"No","1-4%",{"v":5.283474231980442e-05,"d":"0.005%"}]
[{"$nulls":5},"Other",null,"Acrylate","Trade Secret",0.0038036398400000003,{"v":116.23643310356971,"d":"116 "},"No","3-8%",{"v":0.00011623643310356971,"d":"0.012%"}]
[{"$nulls":5},"Other",null,"Peroxide","Trade Secret",0.00069157088,{"v":21.133896927921764,"d":"21 "},"No",{"v":0.9999,"d":"99.99%"},{"v":2.1133896927921765e-05,"d":"0.002%"}]
[{"$nulls":5},"Other",null,"Additive","Trade Secret",0.00138314176,{"v":42.26779385584353,"d":"42 "},"No",{"v":0.0001,"d":"0.01%"},{"v":4.226779385584353e-05,"d":"0.004%"}]
[null,"Gold Wire","HERAEUS","HD",{"v":0.0610677498807721,"d":"0.06"},"Other",null,"Au","7440-57-5",0.06106164310578402,{"v":1865.9988570472833,"d":"1,866 "},"No",{"v":0.9998999999999998,"d":"99.99%"},{"v":0.0018659988570472834,"d":"0.187%"}]
[{"$nulls":5},"Other",null,"Ion Impurities","Trade Secret",{"v":6.10677498807721e-06,"d":"6.11E-06"},{"v":0.18661854755948432,"d":"0 "},"No",{"v":9.999999999999999e-05,"d":"0.01%"},{"v":1.866185475594843e-07,"d":"0.000%"}]
[null,"Molding compound","HITACHI","CEL-9240HF",{"v":18.626399999999997,"d":"18.63"},"Other",null,"Epoxy Resin#1","Trade Secret",0.558792,{"v":17076.272112769202,"d":"17,076 "},"No","0.5-6%",{"v":0.017076272112769204,"d":"1.708%"}]
[{"$nulls":5},"Other",null,"Epoxy Resin#2","Trade Secret",0.6519240000000001,{"v":19922.317464897405,"d":"19,922 "},"No","0.5-6%",{"v":0.019922317464897407,"d":"1.992%"}]
[{"$nulls":5},"Other",null,"Phenol Resin","Trade Secret",0.745056,{"v":22768.36281702561,"d":"22,768 "},"No","2-7%",{"v":0.022768362817025607,"d":"2.277%"}]
[{"$nulls":5},"Other",null,"Carbon black","1333-86-4",0.055879200000000004,{"v":1707.6272112769207,"d":"1,708 "},"No","Approx 0.3%",{"v":0.0017076272112769206,"d":"0.171%"}]
[{"$nulls":5},"Other",null,"Silica","60676-86-0",16.3353528,{"v":499196.35476328636,"d":"499,196 "},"No","82-92%",{"v":0.4991963547632864,"d":"49.920%"}]
[{"$nulls":5},"Other",null,"others","Trade Secret",0.279396,{"v":8538.136056384601,"d":"8,538 "},"No","max 3%",{"v":0.008538136056384602,"d":"0.854%"}]
[null,"Lead finish \n(Matte Sn) on leadframe","Tinking","Sn 99.99%",{"v":0.3273803968,"d":"0.33"},"Other",null,"Sn","7440-31-5",0.3273803968,{"v":10004.503894370635,"d":"10,005 "},"No",{"v":1,"d":"100.00%"},{"v":0.010004503894370635,"d":"1.000%"}]
[null,"DIE","SMIC","silicon",{"v":0.341717376,"d":"0.342"},"Other",null,"Silicon ","7440-21-3",0.341005236988416,{"v":10420.868979322433,"d":"10,421 "},"No",{"v":0.997916,"d":"99.79%"},{"v":0.010420868979322434,"d":"1.042%"}]
[{"$nulls":5},"Other",null,"others","Trade Secret",0.0007121390115839914,{"v":21.762443885966047,"d":"22 "},"No",{"v":0.0020839999999999748,"d":"0.21%"},{"v":2.1762443885966045e-05,"d":"0.002%"}]
[]
[null," Giantec fill in"]
[null,"Supplier or Manufacturing Site fill in"]

{"sheet":"Abbreviations","index":2,"n_rows":51,"n_cols":5,"rows_kept":51,"flags":["formulas_cached_only"]}
["Termination Material Composition:",null,null,"Leadframe (Underplate) Material:"]
["Value","Description",null,"Value","Description"]
["Pure matte tin","100% Sn (matte) - no Ni barrier or annealing (Heat treatment)",null,"Alloy 42","Iron-based leadframe material"]
["Pure matte tin – annealed","100% Sn (matte), annealed is a heat treatment (e.g. 150°C for 1 hour)",null,"Copper","Cu, C194, C151, C7025"]
["Pure matte tin – reflowed","100% Sn (matte), reflowed indicates plating was completely melted after application",null,"Beryllium Copper","Be/Cu"]
["Pure matte tin - Ni barrier","100% Sn (matte), a nickel layer is added between the plating and base metal",null,"Brass","Cu/Zn alloy"]
["Pure matte tin - Ag barrier","100% Sn (matte), a silver layer is added between the plating and base metal",null,"Phosphor Bronze","P-Bronze"]
["Pure matte tin – fused","100% Sn (matte), fusing is a reflow operation in a hot oil bath",null,"Nickel","Ni (Used as barrier layer)"]
["Pure matte tin - reflowed over Nickel barrier","100% Sn (matte), reflowed over a nickel layer",null,"Kovar","Iron/Nickel based material"]
["Pure bright tin","100% Sn (bright) - no Ni barrier or annealing (Heat treatment)",null,"Other - please give details in Comments","To specify on Comment column"]
["Pure bright tin – annealed","100% Sn (bright), annealed is a heat treatment (e.g. 150°C for 1 hour)"]
["Pure bright tin – reflowed","100% Sn (bright), reflowed indicates plating was completely melted after application",null,"RoHS Exemptions:"]
["Pure bright tin - Ni barrier","100% Sn (bright), a nickel layer is added between the plating and base metal",null,"Value","Description"]
["Pure bright tin - Ag barrier","100% Sn (bright), a silver layer is added between the plating and base metal",null,1,"Mercury in compact fluorescent lamps not exceeding 5 mg per lamp"]
["Pure bright tin – fused","100% Sn (bright), fusing is a reflow operation in a hot oil bath",null,"2a","Mercury in straight fluorescent lamps for general purposes not exceeding halophosphate 10mg"]
["Pure bright tin - reflowed over Nickel barrier","100% Sn (bright), reflowed over a nickel layer",null,"2b","Mercury in straight fluorescent lamps for general purposes not exceeding triphosphate with normal lifetime 5 mg"]
["Semi-matte tin","100% Sn, material properties fall in between matte and bright conditions",null,"2c","Mercury in straight fluorescent lamps for general purposes not exceeding triphosphate with long lifetime 8 mg"]
["Nickel/Palladium/Gold","Ni/Pd/Au",null,3,"Mercury in straight fluorescent lamps for special purposes"]
["Nickel/Palladium","Ni/Pd",null,4,"Mercury in other lamps not specifically mentioned in this list"]
["Tin/Silver/Copper","Sn/Ag/Cu",null,5,"Lead in glass of cathode ray tubes, electronic components and fluorescent tubes"]
["Hot Dipped Tin/Silver/Copper","Sn/Ag/Cu applied in a molten tin bath process",null,"6a","Lead as an alloying element in steel containing up to 0.35% lead by weight"]
["Tin/Silver","Sn/Ag",null,"6b","Lead as an alloying element in aluminium containing up to 0.40% lead by weight"]
["Hot Dipped Tin/Silver","Sn/Ag applied in a molten tin bath process",null,"6c","Lead as a copper alloy containing up to 4.0% lead by weight"]
["Tin/Copper","Sn/Cu",null,"7a","Lead in high melting temperature type solders (i.e. lead-based solder alloys containing 85 % by weight or more lead)"]
["Hot Dipped Tin/Copper","Sn/Cu applied in a molten tin bath process",null,"7c","Lead in electronic ceramic parts (e.g. piezoelectronic devices)"]
["Tin/Copper – annealed","Sn/Cu, annealed is a heat treatment (e.g. 150°C for 1 hour)",null,8,"Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations"]
["Tin/Lead","Sn/Pb",null,9,"Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators"]
["Tin/Lead/Silver","Sn/Pb/Ag",null,"9a","DecaBDE in polymeric applications"]
["Nickel/Gold","Ni/Au",null,"9b","Lead in lead-bronze bearing shells and bushes"]
["Tin/Bismuth","Sn/Bi",null,11,"Lead used in compliant pin connector systems"]
["Silver/Palladium","Ag/Pd",null,12,"Lead as a coating material for a thermal conduction module c-ring"]
["Silver/Palladium - Ni barrier","Ag/Pd, a nickel layer is added between the plating and base metal",null,"13a","Lead in optical and filter glass"]
["Silver - Ni barrier","100% Ag, a nickel layer is added between the plating and base metal",null,"13b","Cadmium in optical and filter glass"]
["Gold","100% Au",null,14,"Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight"]
["Gold over Nickel","Au plated over a Ni-barrier layer",null,15,"Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages"]
["Nickel","100% Ni",null,"N/A","Not Applicable"]
["Immersion Silver","Imm. Ag"]
["Immersion Tin","Imm. Sn"]
["Electroplated Silver","100% Ag",null,"Moisture Sensitivity:"]
["OSP","Organic polymer over copper",null,"Value","Description"]
["Hot Dipped Tin","100% Sn applied in a molten tin bath process",null,1]
["Zinc","100% Zn or Zn-alloy",null,2]
["Tin/Zinc","Sn plated over Zn",null,"2a"]
["Aluminum","100% Al",null,3]
["Indium alloy","In bearing alloy",null,4]
["Tin/Copper HASL","Sn/Cu Hot Air Solder Leveled",null,5]
["ENIG","Electroless Nickel Immersion Gold",null,"5a"]
["ENEPIG","Electroless Nickel/Electroless Palladium/Immersion Gold",null,6]
["Other - Please give details in Comments","To  specify on Comment column",null,"ANR","Affected (by moisture exposure), no JEDEC rating"]
[{"$nulls":3},"NMS","Not Moisture Sensitive"]
[{"$nulls":3},"IPC/JEDEC J-STD-020C; go to www.jedec.org"]